Ultrathin copper foil with carrier and printed circuit board

A technology of ultra-thin copper foil and carrier foil, which is applied in the direction of circuit substrate materials, printed circuit components, and secondary processing of printed circuits, etc. It can solve problems such as blistering, uneven peeling, and adverse effects on the human body, and achieve manufacturing quality stable effect

Active Publication Date: 2007-06-20
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if Cr is used for the peeling layer, blisters will occur in the circuit board manufacturing process at high temperature, and the peeling property will be uneven, which will cause some problems in the stable manufacture of the circuit board.
[0011] In addition, some of these metals such as Cr are considered to have adverse effects on the human body, and it is speculated that the use of these metals may be banned in the future

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Carrier foil→Mo-Co (peeling layer)→Manufacture of ultra-thin copper foil with carrier using copper plating (ultra-thin copper foil)

[0095] Using copper foil (thickness: 31 μm) whose Rz of one side is 0.8 μm as a carrier foil, a peeling layer was formed by Mo—Co plating under the following conditions.

[0096] Co content: 4.0g / dm 3

[0097] Mo content: 2.0g / dm 3

[0098] Citric acid: 80g / dm 3

[0099] Current density: 2A / dm 2

[0100] Power on time: 15 seconds

[0101] Bath temperature: 50°C

[0102] The adhesion amount of the formed peeling layer is 1.5mg / dm 2 , the composition ratio is Mo / (Mo+Co)×100=31.

[0103] Electroplate copper with a thickness of 0.2 μm on the formed peeling layer under , and then electroplate it with at 4.5A / dm 2 Electroplate copper at a current density of 3 μm to form an ultra-thin copper foil with a carrier.

[0104] Next, in Ni: 0.5mg / dm 2 , Zn: 0.05mg / dm 2 , Cr: 0.3mg / dm 2 After the surface treatment, the silane coupling ag...

Embodiment 2

[0106] Carrier foil → Mo-Ni (peeling layer) → Manufacture of ultra-thin copper foil with carrier using copper plating (thin copper foil)

[0107] The copper foil (thickness: 31 micrometers) whose Rz of one side is 0.85 micrometers was used as carrier foil, and Mo-Ni plating was produced under the following conditions.

[0108] Nickel sulfate hexahydrate: 50g / dm 3

[0109] Sodium molybdate dihydrate: 60g / dm 3

[0110] Sodium citrate: 90g / dm 3

[0111] Bath temperature: 30°C

[0112] Current density: 3A / dm 2

[0113] Power on time: 20 seconds

[0114] The adhesion amount of the formed peeling layer is 2.4mg / dm 2 , the composition ratio is Mo / (Mo+Ni)×100=29.

[0115] Next, form a 0.2 μm thick copper plating layer on the peeling layer with , and then use at a current density of 4.5A / dm 2 The electroplating forms a copper plating layer, forming an ultra-thin copper foil with a thickness of 3 μm, and making an ultra-thin copper foil with a carrier.

[0116] Next, in Ni:...

Embodiment 3

[0118] Carrier foil → W-Ni (peeling layer) → Manufacture of ultra-thin copper foil with carrier using copper plating (ultra-thin copper foil)

[0119] The copper foil (thickness: 31 micrometers) whose Rz of one side is 0.82 micrometers was used as carrier copper foil, and W-Ni plating was produced under the following conditions.

[0120] Nickel sulfate hexahydrate: 50g / dm 3

[0121] Sodium tungstate dihydrate: 60g / dm 3

[0122] Sodium citrate: 90g / dm 3

[0123] Bath temperature: 70°C

[0124] Current density: 2.5A / dm 2

[0125] Power-on time: 18 seconds

[0126] The adhesion amount of the formed peeling layer is 1mg / dm 2 , the composition ratio is W / (W+Ni)×100=20.

[0127] Next, after forming a copper plating layer with a thickness of 0.2 μm by the above-mentioned on the formed peeling layer, and then by at 3.5A / dm 2 Electroplating at a current density of 3 μm to form an ultra-thin copper foil with a carrier.

[0128] Next, in Ni: 0.5mg / dm 2 , Zn: 0.05mg / dm 2 ,...

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PUM

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Abstract

The invention provides an ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier. The ultrathin copper foil with a carrier of the invention comprises a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying a formula 10<=a / (a+b)*100<=70. In addition, a printed circuit board can be manufactured by using the ultrathin copper foil with a carrier.

Description

technical field [0001] The present invention relates to an ultra-thin copper foil with a carrier and a printed circuit board using the ultra-thin copper foil with a carrier, in particular to a printed circuit board suitable for high-density ultra-fine wiring (fine layout), multilayer printing Ultra-thin copper foil with carrier for circuit boards and chip on film (COF) circuit boards. Background technique [0002] Generally, in the copper foil used for printed circuit boards used as the basis of printed circuit boards, multilayer printed circuit boards, and chip-on-film circuit boards, the surface of the thermocompression-bonded resin substrate or the like is roughened. The roughened surface exerts an anchoring effect on the substrate, improves the bonding strength between the substrate and the copper foil, and ensures reliability as a printed circuit board. [0003] Recently, the roughened surface of the copper foil is coated with an adhesive resin such as epoxy resin in a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/09H05K1/03H05K3/38
Inventor 铃木裕二茂木贵实星野和弘藤泽哲川上昭
Owner FURUKAWA ELECTRIC CO LTD
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