A copper-gas media Damascus structure and its making method

Abstract

This invention relates to one copper to gas medium Damascus structure, which comprises the following process steps: firstly depositing evaporating organic materials layer between etch block layer and etching and depositing oxidation film; then processing Damascus copper on the film; then removing the organic materials layer and filling with nitrogen gas to fulfill the structure process to form the structure by use of evaporating organic materials.

Description

Technical field [0001] The invention belongs to the art field of integrated circuit manufacturing, and specifically relates to a manufacturing method using copper Damascus technology in integrated circuit production. Background technique [0002] With the continuous progress of integrated circuit manufacturing technology, the volume of semiconductor devices is becoming smaller and smaller, and it is more difficult to connect them. In the past 30 years, the semiconductor industry has used aluminum as the material for connecting devices, but with the shrinking of chips, the industry needs thinner and thinner connections, and the high resistance characteristics of aluminum have become increasingly difficult to meet demand. Moreover, in the case of high-density very large-scale integrated circuits, high resistance is likely to cause electronic "jumping", leading to wrong switching states of nearby devices. In other words, chips using aluminum as wires may produce operating conditio...

AI Technical Summary

Problems solved by technology

[0018] However, how to implement the copper-gas dielectric system damascene process in large-scale production is the biggest problem encountered by the industry. The difficulty lies in: on the one hand, it is necessary to ensure that the integrated copper-gas dielectric damascene has a stable structure and a uniform dielectric constant. K≈1 and good thermal conductivity; on the other hand, the process should be easy to realize on the production line, and the manufacturing cost should be as low as possible

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