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Laser processing apparatus

a technology of laser processing and processing equipment, which is applied in the direction of manufacturing tools, semiconductor/solid-state device testing/measurement, semiconductor/solid-state device details, etc., can solve the problems of prolonging processing time, unable to properly form through-grooves along all division lines, and inability to properly form through-grooves

Active Publication Date: 2020-10-20
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a laser processing apparatus that helps create evenly spaced grooves on a workpiece. The apparatus can accurately follow the lines where the cut should be made, resulting in a more precise and efficient processing of the workpiece.

Problems solved by technology

Therefore, when there is a part where the molding resin is abruptly thicker, the molding resin at the part cannot be removed and, hence, a through-groove cannot be formed properly, so that a blind hole state would be generated.
Thus, in the processing method of the related art, it has been impossible to properly form the through-grooves along all the division lines of the workpiece while restraining the processing time from being prolonged.

Method used

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  • Laser processing apparatus
  • Laser processing apparatus
  • Laser processing apparatus

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Experimental program
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embodiment 1

[0035]A laser processing apparatus according to Embodiment 1 will be described. FIG. 1 is a perspective view depicting schematically a configuration example of the laser processing apparatus according to Embodiment 1. FIG. 2A is a perspective view of a wafer constituting a packaged wafer as an object to be processed by the laser processing apparatus according to Embodiment 1. FIG. 2B is a perspective view of a device of the wafer depicted in FIG. 2A. FIG. 3 is a sectional view of a major part of the packaged wafer as the object to be processed by the laser processing apparatus according to Embodiment 1. FIG. 4 is a perspective view depicting a packaged device chip obtained by dividing the packaged wafer depicted in FIG. 3.

[0036]The laser processing apparatus 1 depicted in FIG. 1 according to Embodiment 1 is an apparatus for applying ablation to division lines 202 of a packaged wafer 201 depicted in FIG. 3 as a workpiece, thereby dividing the packaged wafer 201 into packaged device c...

embodiment 2

[0085]A laser processing apparatus according to Embodiment 2 will be described. FIG. 19 is a perspective view of a wafer as an object to be processed by the laser processing apparatus according to Embodiment 2. In FIG. 19, the same sections as those in Embodiment 1 above are denoted by the same reference symbols as used above, and descriptions thereof are omitted.

[0086]The laser processing apparatus 1 according to Embodiment 2, for which an object to be processed is the wafer 204 as the workpiece depicted in FIG. 19, is the same as that in Embodiment 1 in the configuration of the apparatus itself. In a laser processing method using the laser processing apparatus 1 according to Embodiment 2, the wafer 204 is one formed with a low-dielectric-constant insulating material film (low-k film) on a front surface 209 thereof, or one in which the devices 206 are each an imaging element such as complementary metal-oxide-semiconductor (CMOS). The low-dielectric-constant insulating material film...

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Abstract

A laser processing apparatus includes: a chuck table that holds a packaged wafer by a holding surface; a laser processing unit that applies a laser beam to the packaged wafer to form a through-groove along each division line; an X-axis moving unit that moves the chuck table in an X-axis direction; and an examination unit. The chuck table includes: a holding member that forms the holding surface; and a light emitting body. The examination unit includes: a line sensor that extends in a Y-axis direction; and a control unit that determines the result of processing through reception by the line sensor of light from the light emitting body through the through-groove. The line sensor images the whole surface of the packaged wafer being held by the chuck table.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]The present invention relates to a laser processing apparatus.Description of the Related Art[0002]As a processing method for dividing a semiconductor wafer into individual device chips, there have been known cutting by a cutting blade and ablation by application of a pulsed laser beam. In general, each of the individually divided device chips is fixed to a mother substrate or the like, is wired by wires or the like, and is packaged with a molding resin. However, due to a minute crack in a side surface of the device chip or the like, when the device chip is used for a long time, the crack may expand, leading to breakage of the device chip. In order to restrain such breakage of the device chip, a packaging technique of covering side surfaces of the device chip with a molding resin to thereby prevent external environmental factors from influencing the device chip has been developed (see, for example, Japanese Patent Laid-open No. 2...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): B23K26/364B23K26/03H01L21/78H01L21/66H01L21/67H01L21/56H01L21/683H01L23/31B23K103/00
CPCH01L21/67092H01L21/67253H01L21/67288H01L22/20B23K26/032H01L22/12B23K26/364H01L21/78B23K2103/56H01L23/3178H01L21/6838H01L21/561B23K26/206B23K26/361B23K26/53
Inventor BAN, YURIYOSHIDA, YUTAODANAKA, KENTARO
Owner DISCO CORP