Method and system of reducing charged particle beam write time
a technology of charged particle beams and write time, applied in the field of lithography, can solve the problems of difficult to accurately translate the physical design to the actual circuit pattern developed on the resist layer, and the most difficult parts to write reliably on the surface of negative features
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[0025]The present disclosure describes methods for reducing charged particle beam write time by reducing the dose required to expose a shot or a shape in a relatively low-density exposure area by casting an artificial background dose in the area.
[0026]The cost of charged particle beam lithography is directly related to the time required to expose a pattern on a surface, such as a reticle or wafer. Conventionally, the exposure time is related to the amount of exposure required to write the pattern. For the most complex integrated circuit designs, forming the set of layer patterns, either on a set of reticles or on a substrate, is a costly and time-consuming process. It would therefore be advantageous to be able to reduce the exposure required to form these patterns, on a reticle and other surfaces, such as by reducing the time required to write them.
[0027]Referring now to the drawings, wherein like numbers refer to like items, FIG. 1 illustrates an embodiment of a lithography system,...
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