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Method and system of reducing charged particle beam write time

a technology of charged particle beams and write time, applied in the field of lithography, can solve the problems of difficult to accurately translate the physical design to the actual circuit pattern developed on the resist layer, and the most difficult parts to write reliably on the surface of negative features

Active Publication Date: 2021-01-05
D2S
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes methods and systems for creating patterns on surfaces using a charged particle beam. The system calculates the backscatter of the pattern and creates an artificial background dose, which is combined with the original exposure information to create a modified set that will be used to create the pattern. Overall, this allows for more precise and accurate pattern creation.

Problems solved by technology

An example of an end-use limitation is defining the geometry of a transistor in a way in which it cannot sufficiently operate at the required supply voltage.
The design rule limitations reflect, among other things, the smallest dimensions that can be reliably fabricated.
As the critical dimensions of the circuit pattern become smaller and approach the resolution value of the exposure tool, the accurate transcription of the physical design to the actual circuit pattern developed on the resist layer becomes difficult.
Narrow spaces are harder to write reliably than equally narrow lines, so these negative features often end up being the most difficult parts to write reliably on a surface.

Method used

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  • Method and system of reducing charged particle beam write time
  • Method and system of reducing charged particle beam write time
  • Method and system of reducing charged particle beam write time

Examples

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Embodiment Construction

[0025]The present disclosure describes methods for reducing charged particle beam write time by reducing the dose required to expose a shot or a shape in a relatively low-density exposure area by casting an artificial background dose in the area.

[0026]The cost of charged particle beam lithography is directly related to the time required to expose a pattern on a surface, such as a reticle or wafer. Conventionally, the exposure time is related to the amount of exposure required to write the pattern. For the most complex integrated circuit designs, forming the set of layer patterns, either on a set of reticles or on a substrate, is a costly and time-consuming process. It would therefore be advantageous to be able to reduce the exposure required to form these patterns, on a reticle and other surfaces, such as by reducing the time required to write them.

[0027]Referring now to the drawings, wherein like numbers refer to like items, FIG. 1 illustrates an embodiment of a lithography system,...

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PUM

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Abstract

A method for exposing a pattern in an area on a surface using a charged particle beam lithography is disclosed and includes inputting an original set of exposure information for the area. A backscatter is calculated for the area of the pattern based on the exposure information. An artificial background dose is determined for the area. The artificial background dose comprises additional exposure information and is combined with the original set of exposure information creating a modified set of exposure information. A system for exposing a pattern in an area on a surface using a charged particle beam lithography is also disclosed.

Description

BACKGROUND OF THE DISCLOSURE[0001]The present disclosure is related to lithography, and more particularly to the design and manufacture of a surface which may be a reticle, a wafer, or any other surface, using charged particle beam lithography.[0002]Three common types of charged particle beam lithography are unshaped (Gaussian) beam lithography, shaped charged particle beam lithography, and multi-beam lithography. In all types of charged particle beam lithography, charged particle beams shoot energy to a resist-coated surface to expose the resist.[0003]Shaped charged particle beam lithography may be variable shaped beam (VSB) or character projection (CP), in which a shot of a precise electron beam is shaped and steered so as to expose a resist-coated surface, such as the surface of a wafer or the surface of a reticle. In VSB, these shapes are simple shapes, usually limited to rectangles of certain minimum and maximum sizes and with sides which are parallel to the axes of a Cartesian...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): G05B19/4099
CPCG05B19/4099G05B2219/45028H01J37/3174H01J2237/31769H01J2237/31774H01J2237/31776H01J2237/31793H01L21/0274G03F1/20G03F7/2059
Inventor FUJIMURA, AKIRAZABLE, HAROLD ROBERTSHIRALI, NAGESHGUTHRIE, WILLIAM E.PEARMAN, RYAN
Owner D2S