Label sheet for cleaning and conveying member having cleaning function

Abstract

A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Description

[0001] The present invention relates to a label sheet for cleaning various equipments, and a label sheet for cleaning and a conveying member having a cleaning function for a substrate processing equipment which hates foreign matters, for example, a manufacturing equipment or a checking equipment for a semiconductor, a flat panel display or a printed board.[0002] Various substrate processing equipments convey each conveying system and a substrate in physical contact with each other. In that case, if foreign matters stick to the substrate or the conveying system, succeeding substrates are successively contaminated. Therefore, it is necessary to periodically stop the equipment and to carry out a washing process. For this reason, there is a problem in that an availability factor is reduced and a great deal of labor is required. In order to solve the problem, there have been proposed a method of removing foreign matters sticking into a substrate processing equipment through cleaning by c...

AI Technical Summary

Benefits of technology

0007] In order to achieve the object described above, the inventors made investigations earnestly. As a result, they found that when the cleaning sheet or the substrate having the sheet fastened thereto is conveyed to remove foreign matters sticking into the substrate processing equipment through cleaning, an adhesion is set to have a specific value or less with an active energy source as the cleaning layer and the cleaning sheet is set to have the label shape, resulting in removal in the foreign matters more easily and reliably without making the troubles described above. Thus, they have completed the invention.

Problems solved by technology

In that case, if foreign matters stick to the substrate or the conveying system, succeeding substrates are successively contaminated.

For this reason, there is a problem in that an availability factor is reduced and a great deal of labor is required.

According to this method, however, there is a possibility that the adhesive substance and a contact portion in the equipment might be bonded too strongly to be removed.

Therefore, the substrate might not be conveyed reliably.

In particular, in the case in which a pressure reducing absorption mechanism is used for a chuck table of the equipment, this problem is remarkable.

Moreover, the method of removing foreign matters by conveying a plate-shaped member can carry out the conveyance without a hindrance but has a deterioration in a dust cleaning property which is important.

Furthermore, in the case in which a cleaning sheet having a greater size than the size of the substrate is bonded to the substrate and is then cut along the shape of the substrate, a cutting step is further required and a cut refuse generated by the cutting might stick to the substrate or an equipment.

In some cases, however, an adhesive of the cleaning layer might leak out of a punched surface during the sheet punching and might stick to an end of the label so that appearance is deteriorated due to defective punching or conveyance troubles are made.

In the case in which an adhesive of a polymerization and curing type is used, furthermore, the adhesive on the end of the label causes defective curing by polymerization inhibition due to oxygen inhibition if the curing is to be carried out after the sheet punching.

Therefore, the contact portion of the substrate processing equipment might be contaminated by the adhesive.

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