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Polishing pad comprising biodegradable polymer

a biodegradable polymer and polishing pad technology, applied in the field of polishing pads, can solve the problems of limiting the number of polishing pads, limiting the number of, and limiting the number of recycling applications

Inactive Publication Date: 2005-05-12
CABOT MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides a polishing pad made from a biodegradable polymer that can be used for chemical-mechanical polishing. The biodegradable polymer can be made from various acids, monosaccharides, and other compounds. The invention also provides a method for polishing a workpiece by contacting it with the polishing pad and a polishing composition, and moving the pad relative to the workpiece to remove any rough edges. The technical effect of this invention is to provide a polishing pad that is environmentally friendly and can be easily replaced after use.

Problems solved by technology

While many of these polishing pads are suitable for their intended use, such polishing pads typically are discarded after use and end up in the solid waste stream, headed for rapidly vanishing and increasingly expensive landfill space.
While some efforts at recycling have been made, the nature of polymers and the way they are produced and converted to products limits the number of;possible recycling applications.
Though many biodegradable polymers are known and are used in various plastics applications, biodegradable polymers have not been used in polishing pads for chemical-mechanical polishing.

Method used

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Effect test

Embodiment Construction

[0008] The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. A biodegradable polymer is a polymer capable of being decomposed in nature. For example, biodegradable polymers can be broken down by biological agents such as bacteria. The biodegradability of the polymers is related to the presence of reactive hydrolytic linkages, such as amide, enamine, ester, urea, and urethane linkages, along the polymer backbone. The presence of such hydrolytic linkages tends to make the polymers highly polar and thus hydrophilic. The biodegradability of the polymer will vary with the nature of the linkage, the nature of the substituent, the configuration of the polymer chains, the conformation of the polymer chains, and the morphology of the polymers. Generally, the more hydrophilic the polymer backbone and polymer endgroups, the more biodegradable the polymer.

[0009] Desirably, the biodegradable polymer is a homopolymer, block copo...

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Abstract

The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydroxybutyric acid, hydroxyvaleric acid, caprolactone, p-dioxanone, trimethylene carbonate, butylene succinate, butylene adipate, monosaccharides, dicarboxylic acid anhydrides, enantiomers thereof, and combinations thereof. The invention is further directed to methods of its use.

Description

FIELD OF THE INVENTION [0001] This invention pertains to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. BACKGROUND OF THE INVENTION [0002] Chemical-mechanical polishing (“CMP”) processes are used in the manufacturing of microelectronic devices to form flat surfaces on semiconductor wafers, field emission displays, and many other microelectronic workpieces. For example, the manufacture of semiconductor devices generally involves the formation of various process layers, selective removal or patterning of portions of those layers, and deposition of yet additional process layers above the surface of a semiconducting workpiece to form a semiconductor wafer. The process layers can include, by way of example, insulation layers, gate oxide layers, conductive layers, and layers of metal or glass, etc. It is generally desirable in certain steps of the wafer process that the uppermost surface of the process layers be planar, i.e., flat, for the dep...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B24B1/00B24B37/04B24D7/12
CPCB24B37/205B24B37/24B24B37/22
Inventor PRASAD, ABANESHWAR
Owner CABOT MICROELECTRONICS CORP
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