Heat riser

Abstract

A heat riser for bridging the gap between a heat source and a heat dissipation device in an electronic component, the heat riser formed of a flexible graphite article having two operative surfaces, one of which is in operative contact with a surface of the heat source and the other of which is in operative contact with a surface of the heat dissipation device.

Description

[0001] Be it known that we, Joseph P. Capp, a citizen of the United States of America residing at 10094 Juniper Court, Strongsville, Ohio; and Gary G. Chen, a citizen of the United States of America, residing at 5293 Big Creek Parkway, Apt. #3, Parma, Ohio, have invented a new and useful invention entitled “HEAT RISER.”TECHNICAL FIELD [0002] The present invention relates to a heat riser for bridging the gap between the heat source in an electronic device and a heat dissipation apparatus. More particularly, the inventive heat riser comprises a resin-impregnated graphite artifact formed of compressed particles of exfoliated graphite. BACKGROUND OF THE INVENTION [0003] With the development of more and more sophisticated electronic devices, including those capable of increasing processing speeds and higher frequencies, having smaller size and more complicated power requirements, and exhibiting other technological advances, such as microprocessors and integrated circuits in electronic an...

AI Technical Summary

Benefits of technology

[0015] The present invention provides a graphite-based heat riser formed from compressed particles of exfoliated graphite. More specifically, the inventive heat riser is formed of articles of epoxy impregnated graphite compressed (such as by calendering) and then cured at elevated temperatures and pressures. The resultant material exhibits unexpectedly good mechanical

Problems solved by technology

However, microprocessors, integrated circuits and other sophisticated electronic components typically operate efficiently only under a certain range of threshold temperatures.

The excessive heat generated during operation of these components can not only harm their own performance, but can also degrade the performance and reliability of the overall system and can even cause system failure.

The increasingly wide range of environmental conditions, including temperature extremes, in which electronic systems are expected to operate, exacerbates the negative effects of excessive heat.

However, one issue which has arisen in efficient heat dissipation from electronic devices is the space requirements and limitations in some electronics, especially portable devices like laptop computers, personal digital assistants (PDAs), cell phones and the lik

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