107results about How to "Excellent mechanical and thermal properties" patented technology

A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1° C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.

The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.

A method for manufacturing a carbon nanotube composite, comprising the steps of: (a) preparing a solution of a polymer precursor; (b) immersing carbon nanotubes in the solution and ultrasonically cleaning the solution; (c) polymerizing the polymer precursor in order to obtain a polymer matrix having carbon nanotubes uniformly dispersed therein; (d) forming the polymer matrix into a composite having carbon nanotubes distributed therein by way of extrusion; and (e) elongating the composite so as to cause the carbon nanotubes to be orderly distributed therein.

Aligned carbon nanotubes and composites for electrical interconnect and thermal interface materials are provided. In one preferred embodiment, an aligned carbon nanotube device comprises a substrate and a plurality of carbon nanotubes having a substantially vertical profile. The substantially vertical carbon nanotubes are coupled to the substrate. In another preferred embodiment, a carbon nanotube production method comprises depositing a catalyst on a substrate and flowing at least one of argon, hydrogen, and ethylene over the catalyst for a predetermined time at a predetermined temperature to produce a carbon nanotube. This production method enables production of high purity carbon nanotubes and also enables precise placement of carbon nanotubes on a substrate. Other embodiments are also claimed and described.

An injection molded preform for making a stretch blow molded container having an overall stretch ratio of from about 12 to about 16, wherein the overall stretch ratio is a product of a hoop stretch ratio and an axial stretch ratio, wherein the hoop stretch ratio is from about 5.6 to about 6.5, wherein the axial stretch ratio is from about 2.4 to about 2.7, and wherein the preform comprises a CG PET Copolymer having a free blow volume of from about 650 to about 800 ml measured at 100° C. and 90 psi using a 25 gram weight preform designed for a 500 ml container with a maximum diameter of 65 mm and a height of 200 mm from below the container finish and having a hoop stretch ratio of 5.5 and an axial stretch ratio of 2.6. This invention also relates to a method of making such preforms and stretch blow molded containers and methods of making the same.

Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.

Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4'-oxydianiline (3,4'-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.

A photosensitive resin composition is provided. The composition includes an acrylic copolymer, a photoacid generator and a solvent. The acrylic copolymer includes structural units of Formulae 1, 2, 3 and 4, which are described in the specification. The composition exhibits excellent performance characteristics in terms of mechanical and thermal properties, transmittance, insulating properties, transparency, developability, residual film ratio, heat resistance, flatness and the like. Particularly, the use of the composition facilitates the formation of a pattern as an interlayer insulating film. The composition can also be used to produce a thick film with high transmittance. Therefore, the composition is effectively used as a material for an interlayer insulating layer in LCD fabrication processes. An organic insulating film produced using the composition is also provided.

A heat riser for bridging the gap between a heat source and a heat dissipation device in an electronic component, the heat riser formed of a flexible graphite article having two operative surfaces, one of which is in operative contact with a surface of the heat source and the other of which is in operative contact with a surface of the heat dissipation device.

Nanocomposite materials having electromagnetic-radiation barrier properties comprising layered nanoadditives with or without organic and / or inorganic surface modification; and a polymeric matrix, process for obtainment thereof and use of said nanocomposite materials in applications of packaging, greenhouse films, coatings, etc.

A flip-chip substrate is disclosed, which comprises a core substrate including an aluminum oxide substrate and a first circuit layer, wherein the aluminum oxide substrate has a top surface, a bottom surface, and a plurality of conductive through holes, the conductive through holes connect the top surface and the bottom surface the first circuit layer disposed on the top surface and the bottom surface and electrically connects to the conductive through holes; and a built-up structure disposed on the top surface and the bottom surface and electrically connecting to the first circuit layer. Moreover, the conductive through holes are formed by forming plural through holes through electrolyzing, and then forming a first seed layer and a first metal layer inside the through holes. Therefore, the problem of substrate warpage can be prevented, and the wiring density of the flip-chip substrate can be improved.

A thin film comprising a composition obtained by polymerizing a monomer having the formula I: wherein: R1 is a hydrolysable group, R2 is a polarizability reducing organic group, and R3 is a bridging hydrocarbon group, to form a siloxane material. The invention also concerns methods for producing the thin films. The thin film can be used a low k dielectric in integrated circuit devices. The novel dielectric materials have excellent properties of planarization resulting in good local and global planarity on top a semiconductor substrate topography, which reduces or eliminates the need for chemical mechanical planarization after dielectric and oxide liner deposition.

A silicon polymer material, which has a silicon polymer backbone with chromophore groups attached directly to at least a part of the silicon atoms, the polymer further exhibiting carbosilane bonds. The film forming composition and resulting coating properties can be tailored to suit the specific exposure wavelength and device fabrication and design requirements. By using two different chromophores the refractive index and the absorption co-efficient can be efficiently tuned. By varying the proportion of carbosilane bonds, and a desired Si-content of the anti-reflective coating composition can be obtained.

An organic-inorganic composition, which has a backbone containing —Si—O— units with chromophore groups attached directly to at least a part of the silicon atoms. The film forming composition and resulting coating properties can be tailored to suit the specific exposure wavelength and device fabrication and design requirements. By using two different chromophores the refractive index and the absorption co-efficient can be efficiently tuned and a desired Si-content of the anti-reflective coating composition can be obtained—a high Si-content will give good mechanical and thermal properties and also the required wet etch and dry etch properties.

Disclosed herein are solvent free, dry coating processes for applying a layered material such as graphene, nanoplate graphite, etc., to a substrate. The applied layered material is devoid of any dispersant and substantially uniform in thickness. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. Such processes may be especially useful for applying conductive films onto a polymeric substrate without the need for additives such as a surfactant or a polymeric binder.

The present invention refers to a polyamide moulding composition having an excellent adhesion to metal surfaces. Moreover, the present invention refers to structural parts with a metal component directly bonded to a thermoplastic component (interconnected without using a bonding agent / layer). The present invention also relates to a method for manufacturing of such structural parts by an injection moulding or extrusion processes.

The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1):wherein R1, R2, R3, R4, R5 and Y⊖ are as defined in the specification.The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.

Method for forming a low dielectric constant structure on a semiconductor substrate by CVD processing. The method comprises using a precursor containing chemical compound having the formula of (R1—R2)n-Si—(X1)4-n, wherein X1 is hydrogen, halogen, acyloxy, alkoxy or OH group, R2 is an optional group and comprises an aromatic group having 6 carbon atoms and R1 is a substituent at position 4 of R2 selected from an alkyl group having from 1 to 4 carbon atoms, an alkenyl group having from 2 to 5 carbon atoms, an alkynyl group having from 2 to 5 carbon atoms, Cl or F; n is an integer 1-3. The present precursors allow for a lowering of the electronic dielectric constant compared to conventional dielectric materials, such as silicon dioxide or phenyl modified organo-containing silicon dioxide.

The present invention relates to a polymer blend electrolyte membrane comprising an inorganic polymer having polydimethylsiloxane as a main chain, which has a pore structure at both ends formed by condensation reaction between 3-aminopropyltriethoxysilane and tetraethylorthosilicate, wherein phosphoric acid is chemically linked to an amino group of the pore structure; and a proton-conducting polymer having a cation exchange group at the side chain thereof, as well as a manufacturing method thereof. Generally, proton-conducting electrolyte membranes have significantly reduced ion conductivity at high temperatures. However, proton-conducting electrolyte membranes have advantages in terms of efficiency and cost, and thus it is needed to develop an electrolyte membrane, which has excellent ion conductivity even at high temperature. Accordingly, the present invention aims to provide a polymer blend electrolyte membrane for use at high temperature and a manufacturing method thereof.

The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.

Thin films are disclosed that are suitable as dielectrics in IC's and for other similar applications. In particular, the invention concerns thin films comprising compositions obtainable by hydrolysis of two or more silicon compounds, which yield an at least partially cross-linked siloxane structure. The invention also concerns a method for producing such films by preparing siloxane compositions by hydrolysis of suitable reactants, by applying the hydrolyzed compositions on a substrate in the form of a thin layer and by curing the layer to form a film. In one example, a thin film comprising a composition is obtained by hydrolyzing a monomeric silicon compound having at least one hydrocarbyl radical, containing an unsaturated carbon-to-carbon bond, and at least one hydrolyzable group attached to the silicon atom of the compound with another monomeric silicon compound having at least one aryl group and at least one hydrolyzable group attached to the silicon atom of the compound to form a siloxane material.

A silicon polymer material, which has a silicon polymer backbone with chromophore groups attached directly to at least a part of the silicon atoms, the polymer further exhibiting carbosilane bonds. The film forming composition and resulting coating properties can be tailored to suit the specific exposure wavelength and device fabrication and design requirements. By using two different chromophores the refractive index and the absorption co-efficient can be efficiently tuned. By varying the proportion of carbosilane bonds, and a desired Si-content of the anti-reflective coating composition can be obtained.

The invention concerns a rocket engine wherein the combustion chamber includes at least one first monolithic component made of a thermostructural composite material comprising a porous wall through which the fuel is introduced in the core of the combustion chamber. A small part of the fuel is directed towards the neck for it to be cooled.

The invention relates to a method of preparing wholly aromatic polyester including: mixing monomers, introducing the mixed monomers into a reactor having a rectangular or trapezoidal plate type stirring impeller, and polymerizing the introduced monomers through esterification with a power per unit volume of 10˜60 kW / m3, a length (L) to diameter (D) ratio of the stirring impeller is 1˜3:1, and a distance between the bottom of the reactor and a lower portion of the stirring impeller is 1 / 100˜ 1 / 15 times of the diameter (D); b) pulverizing the obtained polymer; and c) solid state polymerizing the pulverized polymer. The present invention also relates to a method of preparing wholly aromatic polyester having excellent heat resistant properties in which byproduct is effectively discharged by controlling a heating rate and reaction holding time between the weight loss initiating temperature and the melting point of a low molecular weight polymer generated in a melt polymerization in a solid state polymerization, adhesion does not occur, and discoloration due to heating does not occur.

The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1):wherein R1, R2, R3, R4, R5 and Y⊖ are as defined in the specification.The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.

A low dielectric constant polymer, comprising monomeric units derived from a compound having the general formula I (R1—R2)n—Si—(X1)4-n, wherein each X1 is independently selected from hydrogen and inorganic leaving groups, R2 is an optional group and comprises an alkylene having 1 to 6 carbon atoms or an arylene, R1 is a polycycloalkyl group and n is an integer 1 to 3. The polymer has excellent electrical and mechanical properties.

Disclosed herein are substrates which have been dry coated with a layered material. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. In particular, conductive films can be formed on a substrate without the need for additives such as a surfactant or a polymeric binder.