107results about How to "Excellent mechanical and thermal properties" patented technology

Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.

A liquid-crystalline polyester blend composition includes 100 parts by weight of a liquid-crystalline polyester blend and 0.1-300 parts by weight of calcium titanate and / or barium titanate, wherein the liquid-crystalline polyester blend can be obtained by combining liquid-crystalline polyester (A) (LCP A) and liquid-crystalline polyester (B) (LCP B) such that the ratio by weight of (LCP A) / (LCP B) is 99 / 1 to 80 / 20, wherein LCP A and LCP B are as defined in the specification, provided that at least one of LCP A and LCP B includes one or two repeating units that come from corresponding minor copolymerizing components selected from aromatic diol, aromatic dicarboxylic acid, aromatic monocarboxylic acid and aromatic monohydroxy compound.

The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.

Thin films are disclosed that are suitable as dielectrics in IC's and for other similar applications. In particular, the invention concerns thin films comprising compositions obtainable by hydrolysis of two or more silicon compounds, which yield an at least partially cross-linked siloxane structure. The invention also concerns a method for producing such films by preparing siloxane compositions by hydrolysis of suitable reactants, by applying the hydrolyzed compositions on a substrate in the form of a thin layer and by curing the layer to form a film. In one example, a thin film comprising a composition is obtained by hydrolyzing a monomeric silicon compound having at least one hydrocarbyl radical, containing an unsaturated carbon-to-carbon bond, and at least one hydrolyzable group attached to the silicon atom of the compound with another monomeric silicon compound having at least one aryl group and at least one hydrolyzable group attached to the silicon atom of the compound to form a siloxane material.

A method for manufacturing a carbon nanotube composite, comprising the steps of:(a) preparing a solution of a polymer precursor; (b) immersing carbon nanotubes in the solution and ultrasonically cleaning the solution; (c) polymerizing the polymer precursor in order to obtain a polymer matrix having carbon nanotubes uniformly dispersed therein; (d) forming the polymer matrix into a composite having carbon nanotubes distributed therein by way of extrusion; and (e) elongating the composite so as to cause the carbon nanotubes to be orderly distributed therein.

The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1):wherein R1, R2, R3, R4, R5 and Y⊖ are as defined in the specification.The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.