Air ducting cover

Abstract

An air ducting cover for guiding a directed flow of air output by rotation of a fan is proposed. The air ducting cover includes a frame for covering outside of the fan and a flexible cover member having a channel formed therethrough for connecting with the frame. By such arrangement, the directed flow of air output by the rotation of the fan can be guided flexibly by the means of the channel. The ducting cover is able to provide flexibility in common use without the need of being re-designed to meet different applications. Further, the flexible cover member can be replaced easily, so as to solve prior-art problems.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a technique for guiding the flow of air, and more particularly, to an air ducting cover for guiding the flow of air output by the rotation of a fan. BACKGROUND OF THE INVENTION [0002] Electronic devices, especially computers, are broadly used and have almost become commodities. As such, it is desirable to make improvements to the design, manufacture, or the assembly of computer hardware. Such improvements will typically have industrial utilization value if they are able to increase structural simplicity, ease of assembly, production efficiency or cost savings. Such improvements conform to the scope of the patent law that encourages and protects such improvements. In this spirit, the present invention focuses on ways to improve an air conducting cover. [0003] Due to the trend to reduce space requirements and materials usage, as well as increase performance, elements in a computer are highly condensed. As such, it is imper...

AI Technical Summary

Benefits of technology

[0010] In light of the above prior-art drawbacks, a primary objective of the present invention is to provide an air ducting cover that has flexibility in common use.

[0011] Another objective of the present invention is to provide an air ducting cover with a simplified structure.

[0012] Still another objective of the present invention is to provide an air ducting cover with reduced dimensions.

[0013] A further objective of the present invention is to provide an air ducting cover that has an assembly process and a disassembly process that can be easily performed.

[0016] As the air ducting cover proposed in the present invention comprises a frame for covering the outside of a fan and a flexible cover member having a channel formed therethrough for connecting the frame, the directed flow of air output by the rotation of the fan can be selected flexibly by the means of the channel, such that the air conducting cover is able to provide flexibility in common use without the need of being re-designed due to different applications. Further, as the elements being used only comprise a frame and a flexible cover member, the amount of required elements has been significantly reduced, so that the assembly and disassembly processes can be readily performed and the flexible cover member can be replaced easily. Additionally, as the two elements are simplified in structure and occupy less space, the dimensions can be significantly reduced to improve the industrial applicability.

Problems solved by technology

However, due to the highly condensed placement of the elements, it is difficult to pass air past all of the elements, or the amount of the air passing each element can be non-optimal, such that inefficient heat dissipation for some of the elements may result.

Referring to an element such as a central processing unit (CPU), which generates a large amount of heat, damage or system instability may occur due to excessive heat if sufficient and continuous convectional cold air isn't provided for heat exchange when the server comes up to normal operating temperature.

However, as it is a plastic product characterized with large dimensions and an excessive amount of elements that are complicated in structure, it can be time-consuming to perform the assembly process and the detachment process.

Moreover, as the foregoing patent can only be applied to dissipate the heat generated by an electronic element having certain specifications and dimensions, the flexibility in common use with other specifications cannot be provided, and the replacement of electronic element with other specifications cannot be easily achieved.

For example, when the motherboard is provided with dual central processing units, the use of such an air ducting cover occupies excessive space and adversely affects heat dissipation of other electronic elements.

Therefore, when utilizing the design of the foregoing patent, an air ducting cover needs to be designed to conform to a fixed position according to the development of each of the motherboards, such that production costs cannot be minimized and industrial utilization cannot be improved.

Images