Reactors, systems, and methods for electroplating microfeature workpieces
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[0022]FIGS. 1-9 illustrate several embodiments of reactors, methods, and systems for electrochemically processing seed layers, plating directly onto barrier layers, and depositing materials in other applications. Several specific details of the invention are set forth in the following description and in FIGS. 1-9 to provide a thorough understanding of certain embodiments of the invention. One skilled in the art, however, will understand that the present invention may have additional embodiments, or that other embodiments of the invention may be practiced without several of the specific features explained in the following description.
[0023]FIG. 1 schematically illustrates a reactor 100 for plating onto seed layers, directly onto barrier layers, or otherwise depositing other materials onto workpieces. The reactor 100 includes a vessel 102, a first chamber 110 configured to direct a flow of first processing solution to a processing zone 112, and a second chamber 120 configured to cont...
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