Article comprising conductive conduit channels

Abstract

Disclosed is a process for preparing an article comprising a layer of nonconductive polymeric material comprising a plurality of integral polymer conduit channels containing a substantially transparent conductive material comprising applying the conductive material to the grooves and applying a protective overcoat within the channels.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional application of U.S. Ser. No. 10 / 425,005 filed Apr. 28, 2003, the contents of which are incorporated herein by reference.[0002] The parent application is one of a group of four patent applications cofiled on Apr. 28, 2003, under Ser. Nos. 10 / 424,666; 10 / 425,005; 10 / 424,639; and 10 / 425,012 under attorney Docket Nos. 84872, 85007, 85772 and 85773, respectively. FIELD OF THE INVENTION [0003] The invention relates to a process for malting a transparent patterned conductive sheet aligned to form conduits in the plane of the conductive sheet. BACKGROUND OF THE INVENTION [0004] As electronic devices become smaller, the requirements for precise electrical connection at extremely fine pitch continue to increase. As an example, semiconductors, such as integrated circuits, are formed on wafers that are then cut into dice or chips that individually may be mounted on substrates. Typically, the substrate has fine elect...

AI Technical Summary

Benefits of technology

[0021] The invention provides readily manufactured article exhibiting improved light transmission while simultaneously providing conductive conduits. The invention also provides a means to protect the delicate transparent conductive coatings from abrasion or harsh ambient conditions such as those typical of display devices.

Problems solved by technology

As electronic appliances, such as computers, tape players, televisions, telephones, and other appliances become smaller, thinner, and more portable, the size requirements for semiconductors and the means for providing electrical connection between semiconductors and substrates, or between flexible circuits and rigid printed circuits, become increasingly demanding.

Whether the sheet material is an elastomer or an adhesive, the continuing challenge is to keep pace with the miniaturization in the electronics industry.

The distribution of the particles after orientation and curing is sufficiently uniform to be functional for certain applications, but is insufficient for other applications.

If the number of particles used in these articles were to be increased in an attempt to reach smaller spacings for finer pitch connections, agglomeration would likely occur thereby causing shorting.

While conductive materials are disclosed, they tend to have low light transmission and therefore are not particularly useful in transmission devices such as liquid crystal displays.

The engraving process has many limitations including misalignment causing tool lines in the surface, high price, and lengthy processing.

This method is difficult to apply to create a master chill roll useful to manufacture complex random three-dimensional structures and is also cost prohibitive.

This procedure to form a master to create three-dimensional features into a plastic film is time consuming and cost prohibitive.

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