Shielded electronic components and method of manufacturing the same

Abstract

A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO2 in a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority from Japanese Patent Application No. JP 2008-286254 filed on Nov. 7, 2008, the content of which is hereby incorporated by reference into this application.TECHNICAL FIELD OF THE INVENTION[0002]The present invention relates to a shielded electronic component and a method of manufacturing the same. More particularly, the present invention relates to mounting of electric components including semiconductors such as a semiconductor-mounting electronic component which requires a shielding structure for avoiding adverse effects of ambient radio waves and electromagnetic noise from semiconductors, and a semiconductor mounting electronic component which requires shielding of noise generated from itself.BACKGROUND OF THE INVENTION[0003]A mobile phone will be exemplified to describe a mounting structure of electronic components including semiconductors.[0004]Various electronic components are mounted on a mountin...

AI Technical Summary

Benefits of technology

[0028]It is supposed that a ratio of metal bonding surface area and a ratio of contact surface area of the shielding metal that is electrically connected with the electrode and the ground wiring connected with a side and / or a surface of the module board are decreased due to deterioration by the temperature cycle test.

[0031]Meanwhile, empirically, a hole in, e.g., a slit-like shape in a shield allows electromagnetic noise to pass through. A slit-like crack generated by deterioration depending on usage environment causes reduction of the shielding effect even when it is short.

[0039]By forming the layer, the anchor effect of the non-electrolytic Ni plating to the resin thereafter can be further stronger. The non-electrolytic Ni plating may be done by a normal method or a non-electrolytic Ni plating method having Ni dissolved in high-pressure CO2 in the same manner with the Pd treatment. The latter method forms a film which forms more diffusion layer because the plating solution itself permeates inside the mold resin.

[0046]Accordingly, a preferred aim of the present invention is to provide an electronic component having a shield with a high reliability in reflow resistance on one side thereof by forming a plating film having no infiltration of CO2 from side surfaces of a board, a high migration reliability, and significantly improved adhesiveness by forming a plating base under high-pressure CO2.

[0051]That is, an advantage obtained by the typical one of the inventions is to manufacture an electronic component having a shield with a high reliability in reflow resistance on one side thereof by forming a plating film having no infiltration of CO2 from side surfaces of a board, a high migration reliability, and significantly improved adhesiveness by forming a plating base under high-pressure CO2.

Problems solved by technology

Also, in a temperature cycle test (e.g., −30° C. / 125° C. in 30 min. cycle) after a reflow test in order to proving reliability, a failure occurs such that the shielding film formed by applying a paste has a deteriorated shielding property as the adhesiveness with the layer connected with the ground is decreased.

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