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White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device

a hybrid resin and optoelectronic technology, applied in the direction of solid-state devices, dyeing processes, textiles and paper, etc., can solve the problems of reducing mechanical strength, unable to solve the problem of yellowing in long-term, and encapsulant and substrate degradation in a substantial way, so as to achieve effective curability and improve strength, the effect of maintaining heat resistance and light resistan

Active Publication Date: 2011-03-03
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]An object of the invention is to provide a white heat-curable silicone / epoxy hybrid resin composition for optoelectronic devices, which is successful in improving the strength of silicone resins by virtue of a silicone resin / epoxy resin hybrid material and which cures into a uniform product maintaining heat resistance and light resistance and experiencing least yellowing over a long period of time. Another object of the invention is to provide a method for preparing the composition, a LED-receiving premolded package comprising the composition in the cured state, and an LED device.
[0039]The white heat-curable silicone / epoxy hybrid resin composition of the invention is effectively curable and cures into a uniform product having improved strength while maintaining heat resistance and light resistance and experiencing least yellowing over a long period of time. Then premolded packages obtained by molding and curing the composition are very useful in the industry in accommodating high-intensity LEDs and solar cells. The composition is also useful as an underfill material for LED parts.

Problems solved by technology

However, these encapsulants and substrates are substantially degraded during long-term service and susceptible to visible color shading, separation and a lowering of mechanical strength.
None of these patents succeed in solving the problem of yellowing during long-term service at high temperature.
Since this organopolysiloxane must be transparent and liquid at room temperature, the composition does not lend itself to transfer molding and compression molding.

Method used

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  • White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device
  • White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device
  • White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

[0102]A 1-L flask was charged with 100 parts of methyltrichlorosilane and 200 parts of toluene. Under ice cooling, a mixture of 8 parts of water and 60 parts of isopropyl alcohol was added dropwise over 5 to 20 hours while maintaining an internal temperature between −5° C. and 0° C. The reaction mixture was then heated and stirred at the reflux temperature for 20 minutes. The reaction mixture was cooled to room temperature, after which 12 parts of water was added dropwise below 30° C. over 30 minutes, followed by 20 minutes of stirring. Further 25 parts of water was added dropwise, after which the mixture was stirred at 40-45° C. for 60 minutes. Thereafter, 200 parts of water was added whereupon the organic layer was separated. The organic layer was washed until neutral. This was followed by azeotropic dehydration, filtration and vacuum stripping, yielding 36.0 parts of a heat-curable silicone resin (A-1) having the following formula (5) as a colorless transparent solid (m.p. 76° C....

synthesis example 2

[0103]A 1-L flask was charged with 80 parts of methyltrichlorosilane, 20 parts of tetraethoxysilane, and 200 parts of toluene. Under ice cooling, a mixture of 8 parts of water and 60 parts of isopropyl alcohol was added dropwise over 5 to 20 hours while maintaining an internal temperature between −5° C. and 0° C. The reaction mixture was then heated and stirred at the reflux temperature for 20 minutes. The reaction mixture was cooled to room temperature, after which 12 parts of water was added dropwise below 30° C. over 30 minutes, followed by 20 minutes of stirring. Further 25 parts of water was added dropwise, after which the mixture was stirred at 40-45° C. for 60 minutes. Thereafter, 200 parts of water was added whereupon the organic layer was separated. The organic layer was washed until neutral. This was followed by azeotropic dehydration, filtration and vacuum stripping, yielding 36.0 parts of a heat-curable silicone resin (A-2) having the following formula (6) as a colorless...

synthesis example 3

[0116]Preparation of Epoxy Resin Prepolymer

[0117]Reaction of an epoxy resin with an acid anhydride was carried out by combining suitable amounts of ingredients and heating under appropriate conditions as shown in Table 1.

TABLE 1Pre-reaction productFormulation (pbw)(1)(2)(3)PremixingTEPIC-S454545Rikacid MH5555Rikacid TH55Triphenyl33phosphiteMolar ratioepoxy / acid1.41.41.4anhydrideReaction conditions80° C. / 10 hr80° C. / 10 hr80° C. / 10 hrWeight average molecular300031003000weight

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Abstract

A white heat-curable silicone / epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR1)(OR2)2 wherein R1 and R2 are organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No. 2009-201559 filed in Japan on Sep. 1, 2009, the entire contents of which are hereby incorporated by reference.TECHNICAL FIELD[0002]This invention relates to white heat-curable silicone / epoxy hybrid resin compositions for optoelectronic devices, curing into parts having whiteness, heat resistance, light resistance and improved strength, a method for preparing the same, premolded packages for receiving light emitting diodes (LED) comprising the compositions in the cured state, and LED devices.BACKGROUND ART[0003]Optical semiconductor parts such as LED have many advantages including small size, efficiency, vivid color emission, elimination of bulb failure, excellent drive characteristics, resistance to vibration, and resistance to repeated turn-on and off. These parts are thus often utilized as various indicators and light sources. Optoelectroni...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08K5/52C08J3/20
CPCC08G59/3236C08G77/16C08K5/34926C08K5/524C08L63/00H01L2224/48091C08L83/04C08L63/06H01L2224/48247C08L83/00C08L2666/14H01L2924/00014H01L2924/12044H01L2924/00
Inventor SAWADA, JUNICHITAGUCHI, YUSUKE
Owner SHIN ETSU CHEM IND CO LTD
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