Distributed cooling of arrayed semi-conductor radiation emitting devices

Abstract

Techniques for the removal of waste heat from solid state, semiconductor devices (such as cooking or heating devices) are provided. In particular, techniques for conducting waste heat away from the device through a heat sink in contact with a cooling system are provided. In addition, a multi-head cooling system applicable to multiple solid state, semiconductor sources is provided.

Description

[0001]This application is based on and claims priority to U.S. Provisional Application No. 61 / 350,352, filed Jun. 1, 2010, which is incorporated herein by reference in its entirety.FIELD[0002]The presently described embodiments relate, in general, to a novel system configuration(s) and associated methods for the removal of waste heat from solid state, semi-conductor array cooking systems and, in particular, to the conduction of the waste heat away from the devices array through a heat sink in contact with a cooling system. In addition, this application includes a design of a multi-head cooling system applicable to cool multiple solid state, semi-conductor array irradiation sources.BACKGROUND[0003]The advantages of heating and cooking with irradiation produced by arrays of semi-conductor devices have been well documented. For example, a prior patent, U.S. Pat. No. 7,425,296, discloses such advantages. Increased device lifetime, greater output energy control, improved energy efficienc...

AI Technical Summary

Benefits of technology

[0006]In one aspect of the presently described embodiments, the system comprises a mounting substrate to which the array of semi-conductor based radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having

Problems solved by technology

Indeed, the primary failure mode of any semi-conductor devices is the damage that can occur during overheating.

Metal heat sinks and forced air systems have the disadvantage of low cooling capacity, with the best possible temperature set at the local ambient temperature while pumped liquid systems require large reservoirs, bulky pumps and provide only low relative efficiency when maintaining the coolant temperature near or below ambient.

Images