Apparatus for manufacturing semiconductor devices

Abstract

The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a pumping device; a vacuum chamber connected to the pumping device; and an optical system configured to determine the position of alignment marks on the surfaces of the semiconductor wafers to be bonded in the bonding module. The apparatus also includes a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a division of application Ser. No. 12 / 888,251 filed Sep. 22, 2010.FIELD OF INVENTION[0002]The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus comprises a bonding module for the molecular bonding of wafers.BACKGROUND OF THE INVENTION[0003]Three-dimensional (3-D) integrated circuit technology where circuit structures formed on several silicon-on-insulator (SOI) substrates are bonded together and integrated into a 3-D circuit with dense-vertical connections becomes of increasing importance in modern semiconductor technology (see, for example, paper by Burns et al., entitled A Wafer-Scale 3-D Circuit Integration Technology, IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 53, NO. 10, OCTOBER 2006, pages 2507-2516). The building blocks of the 3-D circuit integration technology are fully depleted SOI (FDSOI) circuit fabrication, precision wafer—wafer alignment, low-temp...

AI Technical Summary

Benefits of technology

The present invention relates to a bonding module for semiconductor wafers, which includes a vacuum chamber, a pumping device, and an optical system for positioning the wafers. The bonding module also has moveable chucks for holding the wafers, which can be made of metal or ceramics that resist bending and bowing. The apparatus also includes a loadlock module for transferring wafers to the bonding module and a control unit for positioning the wafers and initiating bonding. The invention also includes a manufacturing system for introducing wafers into the system and performing plasma treatment, cleaning, and transporting the wafers. The technical effects of the invention include improved accuracy in positioning the wafers and more reliable bonding under pressure.

Problems solved by technology

However, molecular bonding faces the severe problems of bonding interface defects, wafer misalignment and wafer overlay defects due to heterogeneous distortions which appear in the transfer layer during its assembly with the receiving substrate.

These distortions result from non-homogeneous deformations that appear in the layer while it is being assembled with the final substrate.

In fact, such distortions can lead to variations in position which may be in the order of several hundred nanometres or even microns.

Since these distortions are not homogenous, it is not possible to correct completely these misalignment errors during subsequently performed photolithography steps.

Thereby non or dysfunctional semiconductor devices may result.

Images