Epoxy resin composition for sealing, and electronic component device

Abstract

The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 μm or less, and the ratio of particles having a particle diameter in excess of 20 μm is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound. An electronic component device in which an electronic component is sealed by a cured product of the aforementioned epoxy resin composition for sealing is provided.

Description

TECHNICAL FIELD[0001]The present invention relates to an epoxy resin composition for sealing and an electronic component device. More particularly, the present invention relates to an epoxy resin composition for sealing having superior adhesion to copper in which oxidation has progressed in the case of using a copper lead frame as well as superior mold release with a molding die, and relates to an electronic component device in which an electronic component is sealed by a cured product of the epoxy resin composition for sealing.[0002]The present application claims priority on the basis of Japanese Patent Application No. 2011-016384, filed in Japan on Jan. 28, 2011, the contents of which are incorporated herein by reference.BACKGROUND ART[0003]In the assembly process of electronic component devices (to be referred to as “packages”), a technique is primarily employed that consists of electrically connecting an aluminum electrode of a semiconductor element (to be referred to as a “semi...

AI Technical Summary

Benefits of technology

The present invention is about an epoxy resin that can be used to seal electronic components like ICs or LSIs. The epoxy resin has good adhesion to copper lead frames, is easy to release from the mold, and can be shaped into various forms during molding. The use of this epoxy resin composition can result in electronic components that are more reliable and efficient.

Problems solved by technology

Consequently, increasingly complex wire bonding steps are being required more than ever before, and in the case of using a copper lead frame, oxidation of the copper surface is progressing to a greater degree as a result of being exposed to high temperatures of 200° C. to 250° C. for long periods of time.

If a conventional sealing material having superior adhesion to unoxidized copper surfaces is used under such conditions, since there are many cases in which adhesion to copper in various surface states in which oxidation has progressed is inferior, there is the problem of the occurrence of separation at the interface between the sealing resin cured product and the lead frame during demolding after sealing and molding the resin and during solder reflow.

In order to inhibit this separation, since improving adhesion between an insert such as the lead frame and the sealing resin cured product is in opposition to improving mold release of the sealing resin cured product from a molding die, when adhesion with an insert such as the lead frame is improved, mold release from the molding die becomes inferior resulting in the problem of decreased moldability.

According to this technique, although adhesion and mold release with respect to unoxidized copper were superior, there was the problem of decreased adhesive strength of the sealing resin to an oxidized copper frame.

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