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Precursor substrate, flexible circuit board and process for producing the same

a flexible circuit board and substrate technology, applied in the direction of instruments, record information storage, transportation and packaging, etc., can solve the problems of overly long coating process, metals generally do not easily adhere to conventional precursor substrates, thick precursor substrates, etc., to save production time and cost, reduce the thickness of the product, avoid wasteful etching

Inactive Publication Date: 2014-08-14
ICHIA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a way to make flexible circuit boards that are thinner, cheaper, and more eco-friendly. We use a special layer to stick the first layer of electrically conducting material to the substrate, which is made using a process called electroless plating. This makes the adhesive layer stronger and more effective, reducing the thickness of the first layer and the time required to apply it. The second layer of electrically conducting material is directly electroplated, which saves money and reduces waste of material. This makes the final product thinner, cheaper, and more eco-friendly.

Problems solved by technology

Metals generally do not easily adhere to conventional precursor substrates.
However these methods result in problems of thick precursor substrates, or difficult and overly long coating processes.
The excess thickness compromises the miniaturization of products.
Difficult and overly long coating processes result in limited production capacity and raised production cost.
The above conventional methods not only cannot overcome problem of necking, but given that the technical and material resources of the precursor substrates are controlled by upstream manufacturers, products that use these precursor substrates are subject to charges by external parties and, due to inability to improve the properties of these products, a fundamental solution for reducing cost is unattainable.
Moreover, the conventional production process requires large amount of etching to form electric circuits, resulting in most of the material being wasted by etching, which is very non-environmentally friendly.
Additionally, the configuration of electric circuits formed by this method has poor options.

Method used

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  • Precursor substrate, flexible circuit board and process for producing the same
  • Precursor substrate, flexible circuit board and process for producing the same
  • Precursor substrate, flexible circuit board and process for producing the same

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second embodiment

[0040]In another embodiment, as shown in the flowchart of FIG. 3 in conjunction with cross-sectional views of FIG. 4A, FIG. 4B, and FIG. 4C, the present disclosure provides a method of manufacturing a multi-layered flexible circuit board, including the following steps. Provide a flexible circuit board P whose surface 11 includes an upper surface 11a and a lower surface 11b. The surface 11 has a first electric circuit E1 protruding from the surface 11 and an empty portion 11c having no first electrical circuit E1 (step S301). Coat an electric insulation layer on the surface 11 of the flexible circuit board P, such that the electric insulation layer fills up the empty portion 11c to form a neighboring interval layer 10a. The electric insulation layer coats the top portion of the first electric circuit E1, forming a vertical interval layer 11d (step S303) such that the electric insulation layer coats at least two sides of the first electric circuit E1 (step S305).

[0041]Preferably, the ...

third embodiment

[0054]Returning to FIG. 2A, FIG. 2B and FIG. 2C, the present disclosure further provides a precursor substrate (label omitted) as a partially finished product of a circuit board, to be used in subsequent circuit board processing. The precursor substrate includes at least: a substrate 10 and a first electrical conducting layer 30. The substrate 10 has a surface 11 which is adhesively enhanced. The adhesively enhanced surface 11 includes an adhesion enhancing layer 20. The first electrical conducting layer 30 adheres to the adhesion enhancing layer 20 such that the first electrical conducting layer 30 encloses the surface 11 of the substrate 10.

[0055]Preferably, the material of the substrate is polyimide; the adhesion enhancing layer 20 includes a palladium adhesion enhancer; the thickness of the first electrical conducting layer 30 is between 50 and 200 nanometers; and the first electrical conducting layer 30 is an electroless plating layer made of a material selected from the group ...

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Abstract

The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present disclosure relates to a precursor substrate, a flexible circuit board and a process for producing the same; in particular, to a precursor substrate, a flexible circuit board and a process of producing the same which conducts electroless plating on a substrate as a precursor material.[0003]2. Description of Related Art[0004]Conventional flexible circuit boards are made by processing precursor substrates. The precursor substrates must be coated with a metal conducting layer to enable subsequent processing. Metals generally do not easily adhere to conventional precursor substrates. Conventional methods of coating metal include metal spraying, sputtering deposition, CVD, vapor deposition, and dry coating. However these methods result in problems of thick precursor substrates, or difficult and overly long coating processes. The excess thickness compromises the miniaturization of products. Difficult and overly lon...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/22H05K3/20
CPCH05K1/028H05K3/22H05K3/20H05K1/0393H05K3/386H05K3/426H05K3/465H05K3/4673H05K2201/0154Y10T428/24521Y10T428/265Y10T428/31678H05K3/46
Inventor CHIU, CHIEN-HWACHAO, CHIH-MINKUO, PEIR-RONGCHIANG, CHIA-HUAHSIAO, CHIH-CHENGKUAN, FENG-PINGLEE, YING-WEIJUANG, YUNG-CHANG
Owner ICHIA TECH