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Electromagnetic wave absorbing sheet and method of manufacturing the same and electronic device using the same

a technology of electromagnetic wave absorbing sheet and manufacturing method, applied in the direction of shielding materials, paper/cardboard containers, instruments, etc., can solve problems affecting adjacent other circuit elements, and achieve the effects of excellent electromagnetic wave absorbing rate, high productivity, and simple manufacturing process

Active Publication Date: 2015-11-26
AMOSENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes an electromagnetic wave absorbing sheet that can block electromagnetic waves in electronic devices, preventing them from affecting other components. The sheet is made from a thin film that is made using a simple manufacturing process, and it has a high imaginary part permeability component in the electromagnetic wave noise frequency band of 300 MHz or higher. The sheet is designed to have no magnetic saturation, which reduces heat generation and loss due to eddy currents. Overall, this patent provides a solution for blocking harmful electromagnetic waves and improving the performance of electronic devices.

Problems solved by technology

However, in the same manner as that of the Korean Patent Laid-open Publication No. 10-2009-123776, the electromagnetic wave shielding sheet disclosed in the Korean Patent Laid-open Publication No. 10-2009-78620 may cause a problem of affecting adjacent other circuit elements due to the electromagnetic wave reflected from the metal deposition layer.

Method used

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  • Electromagnetic wave absorbing sheet and method of manufacturing the same and electronic device using the same
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  • Electromagnetic wave absorbing sheet and method of manufacturing the same and electronic device using the same

Examples

Experimental program
Comparison scheme
Effect test

examples 8 to 11

[0126]Final samples (ARS2-454, ARS2-456, ARS2-457, and ARS2-459) of 40 μm thick of Examples 8 to 11 were prepared by comprising: making an amorphous ribbon made of a Fe67B14Si1Co18 alloy in a thickness of 25 μm by a rapid solidification method (RSP) due to melt spinning; cutting the amorphous ribbon in a sheet form and heat treating the cut sheet at 454° C., 456° C., 457° C., and 459° C., respectively, under no magnetic field, in a nitrogen (N2) atmosphere, for 1 hour, to thereby prepare a laminate sheet of 45 μm thick in the same manner as the Example 1; and performing flake-processing and laminate-processing respectively.

[0127]Permeability values according to the frequency changes were obtained with the samples of Examples 8 to 10, which were illustrated in graphs of FIGS. 13A to 13C.

[0128]In addition, power loss values were measured by using a micro-strip line method shown in FIG. 16, with the samples of Examples 8 to 11, which were illustrated in a graph of FIG. 14.

[0129]The sam...

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Abstract

Provided are an electromagnetic wave absorbing sheet which is a thin film and a low cost and has an excellent electromagnetic wave absorbing rate, a method of manufacturing the same, and an electronic device using the same. The electromagnetic wave absorbing sheet includes: at least one layer thin-film magnetic sheet which is separated into a plurality of fine pieces; a protective film that is adhered on one surface of the thin-film magnetic sheet; and a double-sided tape that is adhered on the other surface of the thin-film magnetic sheet.

Description

TECHNICAL FIELD[0001]The present invention relates to an electromagnetic wave absorbing sheet and a method of manufacturing the same, and more particularly to an electromagnetic wave absorbing sheet which is thin and inexpensive, and has an excellent electromagnetic wave absorbing rate, a method of manufacturing the same, and an electronic device including the electromagnetic wave absorbing sheet.BACKGROUND ART[0002]In recent years, demand for high-speed signal processing, high function, miniaturization of a product, and reducing the thickness of a product shape in an electronic device circuit in association with digital electronic equipment, has been being accelerated. Data processing speeds of various types of semiconductor devices mounted on a printed circuit board (PCB) become high, and thus the component mounting density of active components and passive components mounted on the printed circuit board (PCB) is also going high.[0003]Such components accompany a rapid change of the...

Claims

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Application Information

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IPC IPC(8): H05K9/00
CPCH05K9/0075H05K9/0081Y10T428/25Y10T156/10Y10T428/2804Y10T428/2848Y10T428/26B32B7/12B32B15/04B32B2307/208B32B2307/702B32B2307/704H01Q17/00Y10T428/32B32B27/08H05K9/00H01F1/16H01F1/34H01Q1/52
Inventor JANG, KIL JAELEE, DONG HOONKIM, KI CHUL
Owner AMOSENSE
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