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Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture

Active Publication Date: 2016-01-14
INVENSAS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes techniques for making smaller and stronger computer chips. One method involves using a cavity in the bottom of an interposer to hold a die, which reduces the size of the finished chip. This also improves its ability to dissipate heat. Another method involves making holes in the interposer and attaching other computer components to them, making it easier to create complex circuits. Overall, these techniques improve the performance and functionality of computer chips while also making them more compact.

Problems solved by technology

However, a small IC is a fragile device with tiny, densely packed contact pads which must be connected to possibly larger contact pads of other integrated or non-integrated (discrete) circuits.
However, interposers increase the assembly size and complexity, and they should be as thin as possible to shorten the electrical connections through the interposers.

Method used

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  • Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
  • Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
  • Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture

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Embodiment Construction

[0017]The embodiments described in this section illustrate but do not limit the invention. The invention is defined by the appended claims.

[0018]FIG. 3A shows the beginning stages of fabrication of an interposer 120.1 according to some embodiments of the present invention. The beginning and other stages are similar to those described in U.S. patent application Ser. No. 14 / 214,365, filed Mar. 14, 2014 by Invensas Corporation, and U.S. provisional patent application No. 61 / 952,066, filed Mar. 12, 2014 by Shen et al., both incorporated herein by reference. The interposer substrate 120.1S is initially chosen to be sufficiently thick to provide easy handling and adequate heat dissipation in fabrication. In some embodiments, substrate 120.1S is a monocrystalline silicon wafer of a 200 mm or 300 mm diameter and a thickness of 650 micron or more. These materials and dimensions are exemplary and do not limit the invention. For example, substrate 120.1S can be made of other semiconductor mate...

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Abstract

Semiconductor integrated circuits (110) or assemblies are disposed at least partially in cavities between two interposers (120). Conductive vias (204M) pass through at least one of the interposers or at least through the interposer's substrate, and reach a semiconductor integrated circuit or an assembly. Other conductive vias (204M.1) pass at least partially through multiple interposers and are connected to conductive vias that reach, or are capacitively coupled to, a semiconductor IC or an assembly. Other features are also provided.

Description

BACKGROUND OF THE INVENTION[0001]This document relates to semiconductor integrated circuits (ICs), and more particularly to assemblies with semiconductor integrated circuits.[0002]Multiple ICs can be combined in a high-density assembly to provide needed functionality. High density is desired for small assembly size and also to shorten electrical paths as needed for high speed and low power consumption. However, a small IC is a fragile device with tiny, densely packed contact pads which must be connected to possibly larger contact pads of other integrated or non-integrated (discrete) circuits. To enable such connections, an intermediate IC (interposer) can be provided. Interposers may also increase the mechanical strength of the assembly, absorb stresses generated due to differences in coefficients of thermal expansion (CTE), and improve the ability to dissipate heat that can be generated during operation or manufacture. However, interposers increase the assembly size and complexity,...

Claims

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Application Information

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IPC IPC(8): H01L25/065H01L21/52H01L23/00
CPCH01L25/0652H01L24/83H01L2225/06541H01L21/52H01L2225/06548H01L24/33H01L2224/12105H01L2224/16227H01L2224/73253H01L2224/73259H01L2924/15153H01L2924/15311H01L2924/16235H01L2924/16251H01L2224/92224H01L2225/06527H01L24/73H01L24/92H01L24/94H01L24/97H01L25/50H01L2224/16145H01L2224/17181H01L2224/32145H01L2224/48091H01L2224/48145H01L2224/48227H01L2224/73204H01L2224/73209H01L2224/8182H01L2224/85205H01L2224/9202H01L2224/92125H01L2224/94H01L2224/97H01L2225/06517H01L2225/06589H01L2225/06513H01L2225/06544H01L2225/06524H01L2225/06572H01L23/3121H01L21/561H01L2924/181H01L2224/16225H01L2924/15192H01L2225/1023H01L2225/1058H01L2924/351H01L2224/85H01L2224/81H01L2224/83H01L2924/00H01L2924/00012H01L2924/00014H01L23/49811H01L23/49827H01L23/49844H01L23/5384H01L24/09H01L2224/08165H01L2224/08235
Inventor SHEN, HONGWOYCHIK, CHARLES G.SITARAM, ARKALGUD R.
Owner INVENSAS CORP
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