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Encapsulation structure of display unit and method of forming the same

a technology of encapsulation structure and display unit, which is applied in the field of display device encapsulation structure and the method of forming the same, which can solve the problems of encapsulation structure being extremely likely to be damaged, affecting the appearance of display unit, and affecting the appearance of display devi

Inactive Publication Date: 2016-11-03
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a method for protecting display units in display devices by using a thin film encapsulation structure. This structure can be applied to various display devices, such as AMOLED display units. The main technical effects of this method include: sealing the display unit by an inorganic thin film layer that is transparent, moisture-resistant, and oxygen-resistant, buffering internal and external stresses to the thin film layer by organic films outside the inorganic thin film layer, and restraining the layer from falling off caused by bending stress in the formation of flexible devices. The method also results in a more effective encapsulating and improved mechanical strength of the whole display device compared to Frit packaging.

Problems solved by technology

However, the electronic devices mentioned above are extremely vulnerable to the erosion of moisture and oxygen in the external environment.
Therefore, the encapsulating structure is extremely likely to be damaged when an external force is encountered.
Especially, in the service lifetime test, the encapsulating structure is extremely likely to generate the gap which cause the penetration of the destructive gas in the external environment into the sealing structure, leading to the erosion of the display unit 12 mentioned above and even the damage to the display unit 12 when encountering an external force.
Therefore, the display device can not work properly.

Method used

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  • Encapsulation structure of display unit and method of forming the same
  • Encapsulation structure of display unit and method of forming the same
  • Encapsulation structure of display unit and method of forming the same

Examples

Experimental program
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embodiment 1

[0068]FIGS. 2 to 7 show flow charts of the processes of forming the encapsulation structure of the display unit in an embodiment of the present application. As shown in FIGS. 2 to 5, the application provides a method of forming an encapsulation structure of a display module, comprising the following steps:

[0069]Firstly, as shown in FIG. 1, perform an array process for the display devices on the basis of a substrate (such as Low Temperature Poly Silicon-LTPS substrate) to form the array substrate 21; the above array substrate 21 can be provided with a display area and a non-display area adjacent to the display area. The array substrate 21 of the display area is mainly used for the adhesion and the formation of the display devices; moreover, a thin film transistor display circuit could be laid out on or in the array substrate 21 to drive the display unit that would be formed subsequently.

[0070]Additionally, during the array process, the bank structures 23 (which could be arranged at t...

embodiment 2

[0089]On the basis of the above embodiment 1, as shown in FIG. 7, this embodiment provides a display unit encapsulating structure, said encapsulation structure of the display unit could be used to form various kinds of display devices (such as OLED display device), the above encapsulation structure of the display unit comprises:

[0090]an array substrate 21, could be a substrate to which an array process has been performed, may include but not limited to LTPS substrate, etc.; said array substrate 21 has a front surface (namely the top surface, as shown in FIG. 5) and a bottom surface opposite to the top surface (namely the bottom surface, as shown in FIGS. 5 and 6); the material of the substrate can be glass. A rigid substrate or a flexible substrate could also be used to form the array substrate 21. The array substrate 21, in or on which device structures, such as a driving circuit, used for driving the display unit to emit light, could be arranged.

[0091]Additionally, the array subst...

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Abstract

An encapsulation structure of the display unit and a method of forming the same, mainly use the thin film encapsulation structure to hermetically protect the display unit (such as OLED display unit), that is sealing the display unit by inorganic thin film layer having the characteristics of transparency as well as containing moisture-resistance and oxygen-resistance; buffering the internal and external stresses of the thin film layers and restraining the falling off of the layers caused by the bending stress when forming flexible devices. Meanwhile, the bank features formed by multilayer stack can effectively inhibit the diffusion effect of inorganic coating and the increase of the number of side water retaining walls of thin film device can improve the effect of encapsulation, and the bank structures act as a support of the metal mask during the coating process to prevent the substrate from the damage caused by the metal mask.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application claims priority to and the benefit of U.S. Provisional Application No. 62 / 154,866, filed on Apr. 30, 2015, the entire content of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to the field of display devices, and more specifically, to an encapsulation structure of a display unit and the method of forming the same.[0004]2. Description of the Related Art[0005]Among display devices of an electronic device, electronic devices, such as a light emitting diode (LED) or an organic light emitting diode (OLED), which is used for generating light source, are the key devices for the normal operation of a display device. However, the electronic devices mentioned above are extremely vulnerable to the erosion of moisture and oxygen in the external environment. Therefore, the electronic devices should be protected in isolation in order to ensure the ...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56H01L51/00H01L27/32
CPCH01L51/5256H01L27/3246H01L27/3262H01L51/56H01L51/0034H01L2227/323H01L2251/558H01L2251/301H01L2251/303H01L51/0035Y02E10/549Y02P70/50H10K59/40H10K59/12H10K59/8731H10K71/135H10K59/871H10K71/00H10K59/1213H10K77/10H10K2102/3026H10K50/8428H10K2102/351H10K50/8445H10K50/84H10K50/85H10K50/841H10K50/844H10K59/17H10K59/122H10K85/111H10K85/141H10K59/1201H10K85/10H10K2102/00H01L29/78672
Inventor HO, HSINJUWU, CHIENLINJIANG, HUAN
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD