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Hydrophobic NANO silica mixed thermoplastic hot-melt film with excellent adhesive strength

a thermoplastic and nano silica technology, applied in the direction of film/foil adhesives, heat-activated film/foil adhesives, film/foil adhesives without carriers, etc., can solve the problems of reducing or eliminating the sewing process, requiring a lot of manpower during the manufacturing process, and prone to overflow, etc., to improve the tensile strength, improve the dispersibility, and improve the effect of water resistan

Active Publication Date: 2021-08-05
PARK HEEDAE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0030]There are several effects according to aspects of the present invention. The thermoplastic hot melt film of the present invention is mixed with a nanosilica containing a hydrophobic, lipophilic, functional group on the surface to improve dispersibility and reinforced water resistance. In addition, as the tensile strength is increased, even a thinner hot melt film ensures uniform adhesive strength and excellent durability than that of conventional products, reduces material costs, enables multi-press molding, and saves energy and increases productivity.
[0031]Thermoplastic hot melt film may be evenly distributed on the surface of the fabric without biasing and melting into one side of the fabric by heat and pressure even if the yarn density of fabric is high or low during no-sew press or the diameter of fabric weaving hole is big or small. Thus, it has been found that the adhesive force of the Thermoplastic hot melt film can be maximized by uniformly distributing on the fabric surface.
[0032]There are some advantages according to aspects of the present invention, for examples, not only prevents the fabric from becoming hard but also prevents the overflow phenomenon caused by the hot melt film inserted between the fabrics during the bonding process, thereby the bonding performance can be improved. In addition, the fabric to which the hot melt film is applied is light and overall feel is soft.

Problems solved by technology

As part of this, attempts have been made to reduce or eliminate the sewing process, which requires a lot of manpower during the manufacturing process.
However, since the conventional thermoplastic hot melt film is usually manufactured to a thickness of 0.2 mm or more in order to secure a stable adhesive force, when the hot melt film is sandwiched between fabrics and subjected to No-Sew Press, an overflow phenomenon frequently occurs.
In addition, the fabric product is not only a lot of feeling that the overall weight is heavy, but also feels harder, and there is a disadvantage that does not meet the development trend of lighter weigh fabric.
In particular, the conventional hot-melt-films have the problem of having a thick film thickness of 0.2 mm or more.
In addition to this problem, when no-sew pressing is performed in a state in which the thermoplastic hot-melt film is inserted between fabrics, a problem arises in that an excessive amount of the hot-melt film flows into the fabric having a relatively large hole diameter and the hot-melt film is not present at the adhesive interface, eventually causing adhesive failure.
Namely, if a fabric having a relatively large hole diameter is adhered to a fabric having a relatively small hole diameter, a fabric having a relatively high yarn density is adhered to a fabric having a relatively low yarn density, or different kinds of fabrics are adhered to each other by a hot-melt film, the hot-melt film is excessively penetrated into one side of the fabrics by heat and pressure.

Method used

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  • Hydrophobic NANO silica mixed thermoplastic hot-melt film with excellent adhesive strength

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0072]TPU hot melt film production method according to aspects of the present invention is a method for producing a mixture by mixing it with a raw material used in the polymerization of TPU pellet, the production method may include the following five steps.

[0073]In the first step, 100 nm or less nanosilica was treated with dimethyl dichlorosilane to prepare hydrophobic nanosilica particles having a primary particle size of about 20 nm and including dimethyl groups as hydrophobic functional groups on the surface.

[0074]The second step is to prepare a raw material for the conventional TPU pellet polymerization, in particular polyol, isocyanate, short chain glycol is prepared.

[0075]In the third step, any one of the raw materials shown in step 2 is selected to add hydrophobic nanosilica, or hydrophobic nanosilica is added to the raw materials and kneaded. At this time, the temperature is 80 to 100° C. and the stirring speed is preferably about 20 to 30 rpm.

[0076]In the fourth step, the ...

example 2

[0078]Next, a method of preparing a hot melt film by preparing a masterbatch using a hydrophobic nanosilica, and mixing the masterbatch into a TPU resin or EVA resin by content according to the present invention will be described in detail.

[0079]First, the resins presented above are weighed by content. At this time, the content of the hydrophobic nanosilica is preferably in consideration of dispersibility such that the maximum does not exceed 40%.

[0080]Next, the hydrophobic nanosilica and the resin was added to a conventional kneader, kneaded at a speed of 20 to 30 rpm at a temperature of 100 to 120° C., and cooled, and pulverized so that the diameter was less than 10 mm, and then put into a conventional twin extruder (not shown). At this time, the temperature of the twin screw extruder is maintained at a temperature of 150 to 200° C.

[0081]When the compounded resin in the twin screw extruder is made into pellets while being poured into a cooling water at a temperature of 15 to 20° C...

experimental example 1

[0084]In order to demonstrate the effect on the hydrophobic nanosilica mixed TPU hot melt film prepared in example 1 will be described in detail the experimental results for the adhesion test.

[0085]Below, engineered and sandwich meshes mainly used for an upper and lining fabrics mainly used for lining are used.

[0086]In addition, the adhesive structure and the press working conditions are for the engineered mesh or sandwich mesh corresponding to the upper, an outer material, and the TPU hot melt film is inserted between the lining fabric corresponding to the lining.

[0087]And then press work was carried out at 60 kgf pressure for 30 seconds at 130° C., TPU hot melt film was used as a conventional TPU hot melt film and a TPU hot melt film mixed by the hydrophobic nanosilica content, respectively.

[0088]Table 2 below shows an adhesion test data by thickness / hydrophobic nanosilica content of TPU hot melt film, and the part “-” without numerical value in the adhesive strength (kgf / cm2) fie...

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Abstract

The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed. The resin composition contains nanosilica having a particle size of 1 to 100 nm and containing hydrophobic functional groups on its surface in the range of 0.1 to 5 phr (Parts per Hundred Resin), and the nanosilica forms nanosilica aggregates with an average size of the aggregates is within 100˜1200 nm. The thickness of the thermoplastic hot melt film is 0.02˜0.3 mm. The thermoplastic hot melt film of the present invention is mixed with nanosilica containing hydrophobic functional groups, lipophilic, on the surface to improve dispersibility, strengthen water resistance, and increase tensile strength. The material cost is reduced while securing one adhesive strength and excellent durability, and multi-press molding is possible, which has the effect of increasing energy saving and productivity.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application is a continuation application of U.S. patent application Ser. No. 16 / 733,746, filed on Jan. 3, 2020 and titled, which claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2019-0122818 filed on Oct. 4, 2019 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed, and more particularly, when a thermoplastic hot melt film is inserted and adhered between an adherend (for example, a fabric and a fabric), by using a thermoplastic hot melt film containing hydrophobic nanosilica, a thinner hot melt film ensures uniform adhesive strength and superior durability than conventional products, reduces material costs and enables multi-press molding, which c...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08K9/06C09J7/35C08K3/36C09J11/06
CPCC08K9/06C09J7/35C08K3/36C09J2475/00C08K2201/005C08K2201/011C09J2431/00C09J11/06C09J11/04C09J123/0853C09J175/04C09J7/20C09J7/245C09J7/25C09J7/30C09J2423/04C09J7/10C09J2301/304C09J2301/408C09J2301/414C08K9/04C09J7/381C09J2301/312
Inventor PARK, HEEDAE
Owner PARK HEEDAE
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