Silica spherical particles for semiconductor sealing material

Abstract

The purpose of the present invention is to provide: silica particles of which the maximum particle diameter can be minimized and which can achieve proper fluidability that cannot be achieved by the conventional techniques; and silica spherical particles which, when used as a filler for a heat-dissipating sheet, can achieve excellent heat conductivity and flexibility. Silica spherical particles characterized in that, when particles each having a size of 5 μm or more and imaged by an optical measurement are observed, the particle diameter of each of the particles, which is determined from the image, satisfies the following requirements. Requirements: D99≤29 μm, and 10 μm≤Dmode<D99, and D99 / Dmode≤1.5, and Dmode≤20 μm.

Description

TECHNICAL FIELD

[0001] The present invention relates to silica spherical particles used for a semiconductor sealing material.BACKGROUND ART

[0002] In recent years, semiconductor packages have become increasingly smaller and thinner. Particularly, in applications typified by smartphones, flip-chip connections that can be made thinner by multi-pins with a larger number of pins have been widely used, instead of conventional wire bonding. Flip-chip connection connects electrodes on a silicon chip and a substrate via minute solder balls, and has an advantage of saving space as compared with the conventional wire bonding portion. On the other hand, as the number of pins increases, a distance between adjacent solder balls becomes narrower, and a gap between the silicon chip and the substrate becomes narrower year by year (see Non-Patent Document 1). In the past, when such a narrow gap is sealed, sealing was performed with a resin alone without being filled with a filler. In such a case, it is ...

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