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Photoresist composition and method of manufacturing a display substrate using the same

a technology of photoresist and composition, which is applied in the direction of photosensitive materials, instruments, photomechanical equipment, etc., can solve the problems of remaining patterns, loss of resolution or pattern collapse, and the inability to easily remove photoresist patterns by strippers, so as to improve the reliability of photoresist patterns

Active Publication Date: 2011-07-19
DONGWOO FINE CHEM CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The composition maintains shape integrity at elevated temperatures, prevents cracking, and facilitates easy removal, enhancing the reliability and processing efficiency of photoresist patterns in display substrate manufacturing.

Problems solved by technology

However, when the second thin-film layer is patterned using the remaining pattern as a mask, the remaining pattern can be damaged by the etchant used to pattern the second thin-film layer, or may undergo reflow and thus loss of resolution or pattern collapse.
However, when heat resistance of a photoresist pattern is enhanced, the photoresist pattern may not be readily removed by a stripper.
Furthermore, when the manufacturing (processing) temperature is reduced so as to remove a photoresist pattern easily, cracks may be generated.

Method used

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  • Photoresist composition and method of manufacturing a display substrate using the same
  • Photoresist composition and method of manufacturing a display substrate using the same
  • Photoresist composition and method of manufacturing a display substrate using the same

Examples

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example 1

[0079](a-1) About 12% by weight of a first fractionated novolac resin having a weight average molecular weight of about 20,000 g / mol and prepared by reacting a phenol mixture including m-cresol and p-cresol in a weight ratio of about 60:40 with formaldehyde and fractionating an obtained product by, (a-2) about 8% by weight of a second fractionated novolac resin having a weight average molecular weight of about 20,000 g / mol and prepared by reacting a phenol mixture including m-cresol and p-cresol in a weight ratio of about 50:50 with formaldehyde and fractionating an obtained product by, (b) about 7% by weight of a quinone diazide compound prepared by reacting 2,6-bis[4-hydroxy-3-(2-hydroxy-5-methylbenzyl)-2,5-dimethylbenzyl]-4-methylphenol with 1,2-naphthoquinonediazide-5-sulfonic acid chloride in a mole ratio of about 1:2.2, (c) about 0.5% by weight of 1,3-dihydrobenzene, (d) about 0.5% by weight of SPCY-series polymer (trade name, SHOWA POLYMER) having a weight average molecular w...

example 2

[0080](a-1) About 12% by weight of a first fractionated novolac resin having a weight average molecular weight of about 20,000 g / mol and prepared by reacting a phenol mixture including m-cresol and p-cresol in a weight ratio of about 60:40 with formaldehyde and fractionating an obtained product by, (a-2) about 8% by weight of a second fractionated novolac resin having a weight average molecular weight of about 20,000 g / mol and prepared by reacting a phenol mixture including m-cresol and p-cresol in a weight ratio of about 50:50 with formaldehyde and fractionating an obtained product by, (b) about 7% by weight of a quinone diazide compound prepared by reacting 2,6-bis[4-hydroxy-3-(2-hydroxy-5-methylbenzyl)-2,5-dimethylbenzyl]-4-methylphenol with 1,2-naphthoquinonediazide-5-sulfonic acid chloride in a mole ratio of about 1:2.2, (c) about 0.5% by weight of 1,2,3-trihydrobenzene pyrogallic acid, (d) about 0.5% by weight of SPCY-series polymer (trade name, SHOWA POLYMER) having a weight ...

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Abstract

A photoresist composition includes an alkali-soluble resin, a dissolution inhibitor including a quinone diazide compound, a first additive including a benzenol compound represented by the following Chemical Formula 1, a second additive including an acrylic copolymer represented by the following Chemical Formula 2 and an organic solvent. Accordingly, heat resistance of a photoresist pattern may be improved, and the photoresist pattern may be readily stripped. As a result, crack formation in the photoresist pattern may be reduced and / or prevented.

Description

[0001]This application claims priority to Korean Patent Applications No. 2009-101988, filed on Oct. 27, 2009, and all the benefits accruing therefrom under 35 U.S.C. §119, the contents of which are herein incorporated by reference in their entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This application relates to a photoresist composition and a method of manufacturing a display substrate using the photoresist composition. More particularly, this application relates to a photoresist composition that may be used for a display device, and a method of manufacturing a display substrate using the photoresist composition.[0004]2. Description of the Related Art[0005]In general, a liquid crystal display (“LCD”) panel includes a display substrate, an opposing substrate facing the display substrate and a liquid crystal layer interposed between the display substrate and the opposing substrate. The display substrate includes a gate pattern, a semiconductor pattern, a so...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L21/00
CPCG03F7/0007G03F7/0226H01L27/1214H01L27/1288G03F7/0233Y10S438/948G03F7/0385
Inventor PARK, JEONG-MINLEE, JUNG-SOOCHANG, WON-YOUNGLEE, EUN-SANGYU, IN-HOKIM, SEONG-HYEON
Owner DONGWOO FINE CHEM CO LTD