Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device

Abstract

There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

Description

TECHNICAL FIELD[0001]The invention relates to a thermosetting light-reflecting resin composition for use in an optical semiconductor device including a combination of an optical semiconductor element and wavelength conversion means such as a fluorescent substance, an optical semiconductor element mounting board produced therewith, a method for manufacture thereof, and an optical semiconductor device.BACKGROUND ART[0002]In recent years, optical semiconductor devices including a combination of an optical semiconductor element such as an LED (Light Emitting Diode) and a fluorescent substance have grown in demand and found various applications including an outdoor display, a portable liquid crystal backlight, and automotive applications, because of their advantages such as high energy efficiency and long life. As LED devices have had increased brightness accordingly, the junction temperature has been increased because of increase in the quantity of heat emitted from the elements, or opt...

AI Technical Summary

Benefits of technology

[0006]The invention has been made in view of the above and is directed to a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding, and allows transfer molding processes to be performed continuously. The invention is also directed to a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with such a resin composition, and methods for efficient production thereof.

[0007]The inventors have made investigations on a thermosetting light-reflecting resin composition that can not only have good optical properties and thermal discoloration resistance but also provide good releasability so that optical semiconductor element mounting boards can be continuously formed by molding in a satisfactory manner. As a result, the inventors have made the invention, based on the finding that a shear release force during transfer molding and the surface free energy of the release surface can each be used as an index of releasability and that a specific compound is effective in improving the releasability.

[0044]According to the invention, there is provided a thermosetting light-reflecting resin composition having good optical properties and high releasability. Using such a resin composition makes it possible to form optical semiconductor mounting boards by continuous molding processes in a satisfactory manner. According to the invention, therefore, the frequency with which an external release agent is used during transfer molding is reduced, so that the productivity is increased. The resin composition of the invention also has good light reflection characteristics in the near-ultraviolet region and has high thermal discoloration resistance. Therefore, the resin composition of the invention allows efficient reflection of light from a light-emitting element and allows the production of optical semiconductor mounting boards that can maintain high reliability for a long term.

Problems solved by technology

As LED devices have had increased brightness accordingly, the junction temperature has been increased because of increase in the quantity of heat emitted from the elements, or optical energy itself has been increased, which causes the problem of degradation of device materials.

In many cases, however, most compounds used as release agents are not compatible with based resin including epoxy resin, a curing agent and so on, which form a thermosetting light-reflecting resin composition.

Therefore, when a board is formed by molding a resin composition containing such a release agent, the board is more likely to have poor appearance due to insufficient dispersion of the release agent, and this tends to make continuous molding difficult.

The flow behavior as well as insufficient dispersion of the release agent gives rise to destruction of the package or the poor appearance of the package.

A release agent and a dispersing agent optionally used together with the release agent are often thermally-unstable organic compounds.

For example, therefore, when used for a long time under high temperature conditions or when exposed to high-temperature heating or used for optical semiconductor devices, a resin composition containing such compounds tends to be colored or have a reduced diffuse reflectance, so that it may tend to be difficult to obtain sufficient optical properties or reliability.

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