Secondary packaging device of avalanche photodiode for infrared photodetection

An avalanche photoelectric and packaging device technology, which is applied in measurement devices, photometry, optical radiation measurement, etc., can solve the problems of increased temperature sensitive control of devices, difficulties, and restrictions on sealing materials, so as to reduce volume and heat capacity, and eliminate moisture. The effect of sensitive temperature control

Inactive Publication Date: 2007-10-17
SOUTH CHINA NORMAL UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the vacuum seal, the heat capacity and thermal inertia of the object to be refrigerated are relatively large, which makes it difficult to sensitively control the temperature of the device.
Moreover, constant temperature control also requires vacuum seals to have good thermal insulation properties. Vacuum materials are not the best thermal insulation mater

Method used

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  • Secondary packaging device of avalanche photodiode for infrared photodetection
  • Secondary packaging device of avalanche photodiode for infrared photodetection
  • Secondary packaging device of avalanche photodiode for infrared photodetection

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Embodiment Construction

[0069] The structure of the present invention is shown in Figure 1-7, the bottom of the base 1 has a stepped groove 1-1, the upper end of the base 1 has a bottom groove 1-2 that runs through the left and right end faces of the base, and the bottom groove 1-2 is connected to the bottom surface of the base. Step grooves 1-1 communicate.

[0070] The bottom of the step groove 1-1 places the auxiliary cooling fin 4, the lower part of the auxiliary cooling fin 4 is in the step groove 1-1, and the upper part is in the bottom groove 1-2. The role of the auxiliary heat sink is to play an auxiliary heat conduction role between the avalanche photodiode device and the semiconductor cooling sheet.

[0071] Auxiliary heat sink 4 has an auxiliary heat sink groove 4-1 matched with the connecting flange of the avalanche photodiode device. Cylindrical groove.

[0072] The semiconductor refrigerating sheet 7 is placed in the step groove 1-1 close to the auxiliary heat sink 4, and next to the ...

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Abstract

This invention relates to infrared detecting avalanche photodiode second sealed device, which is located with one step groove on bottom and with one groove through socket on the bottom; the groove is connected to the step groove with assistant radiator with its bottom inside the groove and its top inside the groove; the assistant radiator is opened with one groove matched with flange of the APD device with orderly located with semi-conductor cooling slices, cooling slices wire filling elements; the upper cover is opened with one upper cover groove through left and right ends relative to the bottom groove.

Description

technical field [0001] The invention relates to an optoelectronic device, in particular to a secondary packaging device for an avalanche photodiode (abbreviated as APD, the same below) used for infrared light detection. Background technique [0002] At present, the packaging of APD is for the chip, that is, for the signal input and output of the chip. [0003] At present, in order to reduce the noise of APD devices and improve the performance of single-photon detectors, refrigeration technology is used to make single-photon detectors work in low-temperature environments to obtain maximum detection efficiency. [0004] To make the APD work in a sub-zero low temperature environment, it is usually fixed with a metal base, and then the APD device is placed in a vacuum-sealed and moisture-proof chamber to use the Peltier effect or to cool with liquid nitrogen. For example: [0005] (1) In the article "Single-photon detector for long-distance quantum cryptography" published in t...

Claims

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Application Information

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IPC IPC(8): H01L23/00H01L31/107G01J1/02
Inventor 廖常俊李日豪刘颂豪
Owner SOUTH CHINA NORMAL UNIVERSITY
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