Biocide method in the process of preparation printed circuit board
A printed circuit board and manufacturing process technology, applied in the field of killing microorganisms, can solve the problems of polluted water bodies, incomplete elimination, and unqualified printed circuit boards, and achieve the effect of reducing microorganisms, reducing defective products, and improving the pass rate
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Embodiment 1
[0019] In a factory that produces printed circuit boards, the oxidizing biocide is continuously added to the sink of the wet production line of printed circuit boards, so that each liter of water contains 1-500 mg of oxidizing biocide for one week. The oxidizing biocide is hydrogen peroxide.
[0020] Table 1 shows the statistical results of defective products in the wet process of printed circuit boards before adopting the method of the present invention and after using the method of the present invention to run for one week.
Embodiment 2
[0022] In a factory that produces printed circuit boards, non-oxidizing biocides are continuously added to the sink of the wet production line of printed circuit boards, so that each liter of water contains 1-500 mg of non-oxidizing biocides for one week. The non-oxidizing biocide is a quaternary ammonium salt.
[0023] Table 1 shows the statistical results of defective products in the wet process of printed circuit boards before adopting the method of the present invention and after using the method of the present invention to run for one week.
Embodiment 3
[0025] In a factory that produces printed circuit boards, oxidizing biocides are added to the water tank of the wet production line of printed circuit boards, with a frequency of 1-7 times per week, and the interval between times is 0-6 hours (0 Time indicates that the time interval between times is consistent), and the dosage is 10-1000mg of oxidizing biocide per liter of water each time, and lasts for a week. The oxidizing biocide is hydrogen peroxide.
[0026] Table 1 shows the statistical results of defective products in the wet process of printed circuit boards before adopting the method of the present invention and after using the method of the present invention to run for one week.
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