Method for preparing bakelite by using nonmetal material in waste printing circuit board

A technology of non-metallic materials and phenolic molding compound, which is applied in the fields of recycling and industrial waste treatment, can solve the environmental pollution of circuit board non-metallic materials, and achieve the goal of reducing secondary environmental pollution, protecting forest resources and reducing production costs Effect

Inactive Publication Date: 2009-03-11
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to address the deficiencies of the prior art, to provide a method for preparing phenolic molding compound using non-metallic materials in waste printed circuit boards, to solve the problem of environmental pollution of non-metallic materials in circuit boards, and at the same time to obtain low-cost, high-efficiency Quality eco-friendly synthetic material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The raw material components are by weight: 100 parts of phenolic resin, 25 parts of non-metallic material particles of waste circuit boards, 55 parts of wood powder, 15 parts of hexamethylenetetramine, 30 parts of talcum powder, and 6 parts of stearic acid.

[0020] First, premix the non-metallic material particles of waste circuit boards with hexamethylenetetramine in an amount of 10% of the amount of hexamethylenetetramine, and then mix the premixed raw materials with all other raw materials evenly. Mix for 4 minutes, then cool and granulate to obtain a composite phenolic molding compound.

[0021] After testing, the relative density of the obtained composite phenolic molding compound is 1.42, the bending strength is 75MPa, and the notched impact strength is 2.2KJ / m 2 , The heat distortion temperature is 159°C, and the dielectric strength is 3.0MV / m.

[0022] In the above test data, the relative density is measured according to the A method specified in GB1033-86;

...

Embodiment 2

[0029] The raw material components are by weight: 100 parts of phenolic resin, 45 parts of waste circuit board non-metallic material particles, 45 parts of wood flour, 16 parts of hexamethylenetetramine, 15 parts of calcium carbonate, and 4 parts of zinc stearate.

[0030] First, premix the non-metallic material particles of waste circuit boards with hexamethylenetetramine in an amount of 10% of the amount of hexamethylenetetramine, and then mix the premixed raw materials with all other raw materials evenly. Mix for 5 minutes, then cool and granulate to obtain composite phenolic molding compound.

[0031] After testing, the relative density of the obtained composite phenolic molding compound is 1.40, the bending strength is 81MPa, and the notched impact strength is 2.2KJ / m 2 , heat distortion temperature of 176 ℃, dielectric strength of 2.9MV / m.

[0032] Test method is the same as embodiment 1. The phenolic molding compound obtained in this example fully meets the performanc...

Embodiment 3

[0034] The raw material components are by weight: 100 parts of phenolic resin, 75 parts of non-metallic material particles of waste circuit boards, 25 parts of wood powder, 20 parts of hexamethylenetetramine, 10 parts of talcum powder, and 2 parts of zinc stearate.

[0035] First, premix the non-metallic material particles of waste circuit boards with hexamethylenetetramine in an amount of 10% of the amount of hexamethylenetetramine, and then mix the premixed raw materials with all other raw materials evenly. Mix for 3 minutes, then cool and granulate to obtain composite phenolic molding compound.

[0036] After testing, the relative density of the obtained composite phenolic molding compound is 1.40, the bending strength is 77MPa, and the notched impact strength is 2.2KJ / m 2 , heat distortion temperature of 176 ℃, dielectric strength of 3.8MV / m.

[0037] Test method is the same as embodiment 1. The phenolic molding compound obtained in this example fully meets the performan...

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Abstract

The invention discloses a method for preparing bakelite, which uses nonmetallic material of waste printed circuit board as raw material to replace wood powder. The method includes steps: mixing 100 quotient of phenolic resin, 25-75 quotient of waster circuit board nonmetallic material particles, 25-55 quotient of wood powder, 15-20 quotient of curing agent, 10-30 quotient of inorganic filler and 2-6 quotient of lubricant under temperature of 90-110 DEG C, cooling, granulating and obtaining the product. The invention can solve problems of treatment and pollution of waste circuit board nonmetallic material, and can reduce production cost of bakelite.

Description

technical field [0001] The invention relates to a method for preparing phenolic molding compound by using non-metallic materials in waste printed circuit boards, recycling and utilizing the non-metallic materials of waste printed circuit boards to replace part of wood powder, and preparing phenolic molding compounds at low cost. The invention belongs to the field of industrial waste treatment and recycling in the technical field of environmental protection. Background technique [0002] Waste printed circuit board (PCB) is a kind of electronic waste, which contains more than a dozen metals with high recovery value such as copper, gold, silver, palladium, etc. For example, the metal content in waste mobile phone circuit boards is: gold 280g / t, Silver 2kg / t, copper 1000g / t, palladium 100g / t. The value of metals is the main economic driving force of the waste circuit board recycling industry. The research focus of researchers is also mainly on the recovery of rare and valuable...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08K5/20C08L97/02C08K3/00C08K5/09C08K5/17
Inventor 郭杰许振明诸德祺顾璇张卫东
Owner SHANGHAI JIAOTONG UNIV
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