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Method of fabrication SiGe heterojuction bipolar transistor

A device manufacturing method and transistor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of low parasitic capacitance and small transistor size, and achieve the effect of simple isolation

Inactive Publication Date: 2009-07-29
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] While the gist of US-A-6169007 exhibits the aforementioned advantages of smaller transistor sizes and lower parasitic capacitances, it also exhibits the disadvantages associated with the disclosed fabrication techniques,

Method used

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  • Method of fabrication SiGe heterojuction bipolar transistor
  • Method of fabrication SiGe heterojuction bipolar transistor
  • Method of fabrication SiGe heterojuction bipolar transistor

Examples

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Embodiment Construction

[0021] figure 1 The initial structure is shown, which comprises a standard BiCMOS p-doped substrate 10, represented by a buried collector contact 10b, an N-type collector epitaxial layer 10a, and a surface to provide a buried n-layer collector contact. The contacts between 10b and n plug the dimples 10c. Finally field isolation regions are provided in the form of two shallow trench isolation regions 20 . A thermal oxide layer 12 is grown on top of the substrate 10, followed by a layer stack consisting of a boron in situ doped polysilicon deposition layer 14, a TEOS layer 16, and an amorphous silicon layer 18.

[0022] Refer below figure 2 , which is an enlarged detail of the active region, the transistor region 22 is opened by etching a well through the entire layered stack formed on the thermal oxide layer 12. This is accomplished using a plasma etch step to etch through the amorphous silicon layer 18, the TEOS layer 16, and the polysilicon layer 14. Thermal oxide 12 se...

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Abstract

The present invention provides for a method of fabricating a semiconductor device comprising a non-selectively grown SiGe(C) heterojunction bipolar transistor including the steps of forming an insulating layer ( 12, 40 ) on a substrate and providing a layer structure including a conductive layer ( 14, 42 ) on the insulating layer ( 12, 40 ), etching a transistor area opening ( 12, 44 ) through the conductive layer ( 14, 42 ), depositing a SiGe base layer ( 24, 46 ) on the inner wall of the transistor area opening ( 22, 44 ) and forming an insulator ( 32, 52 ) on an upper surface so as to fill the transistor area opening wherein prior to the filling step, a nitride layer ( 30, 50 ) is formed as an inner layer of the transistor area opening ( 22, 44 ).

Description

technical field [0001] The present invention relates to the fabrication of semiconductor devices comprising SiGe heterojunction bipolar transistors, including bipolar transistors such as SiGeC heterojunction bipolar transistors. [0002] Specifically, the present invention relates to a method for manufacturing a semiconductor device comprising a SiGe(C) heterojunction bipolar transistor by a non-selective epitaxial growth method, the method comprising the following steps: forming an insulating layer on a substrate, Providing a layer structure comprising a conductive layer on the insulating layer, etching a transistor area window through the conductive layer, depositing a SiGe base layer in the transistor area window, and including the steps of filling the transistor area window with an insulator to be etched subsequently. [0003] In this way, the present invention can relate to SiGe(C) heterojunction bipolar transistors using non-selective epitaxial growth, the intrinsic SiGe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/331H01L29/732H01L29/737
CPCH01L29/66242H01L29/737
Inventor P·H·C·马格尼J·J·T·M·唐克斯
Owner NXP BV
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