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Thinner composition for removing photoresist

A technology of photosensitive resin and diluent, applied in detergent composition, detergent compounding agent, photosensitive material processing and other directions, can solve the problems of high volatility and flammability, high viscosity of ethyl lactate, and decreased operation safety.

Active Publication Date: 2009-09-30
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Among the above, when ethylene glycol monoethyl ether acetate is used, the dissolution rate is excellent, but the volatility and flammability are high, and there are particularly problems of causing leukopenia and reproductive toxicity such as fetal abortion.
In addition, ethyl lactate has a slow dissolution rate due to its high viscosity, and cannot obtain a sufficient cleaning effect when used alone. Solvents such as acetone and methyl ethyl ketone have low flash points, and there are problems such as a significant decrease in handling safety.

Method used

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  • Thinner composition for removing photoresist
  • Thinner composition for removing photoresist
  • Thinner composition for removing photoresist

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] 10 parts by weight of propylene glycol monoethyl ether acetate (PGMEA), 80 parts by weight of butyl acetate (NBA), and 10 parts by weight of ethyl lactate (EL) were uniformly mixed to prepare a diluent composition.

Embodiment 2～5、 comparative example 1～4

[0088] Except having used the components and composition ratio shown in the following Table 1 in the said Example 1, it carried out by the method similar to the said Example 1, and prepared the diluent composition. At this time, the units in Table 1 are parts by weight.

[0089] Table 1

[0090]

[0091] In order to measure the degree of removal of unnecessary photosensitive resin by the diluent compositions prepared in Examples 1 to 5 and Comparative Examples 1 to 4, the EBR test described below was implemented, and the results are shown in Table 4 below.

[0092] First, a silicon oxide substrate having a diameter of 8 inches was washed in two baths containing a mixture of hydrogen peroxide and sulfuric acid (5 minutes in each bath), and then washed with ultrapure water. The process is carried out with custom-made cleaning equipment. Thereafter, these substrates were spin-dried using a spin dryer (product of VERTEQ, model: SRD1800-6). Then, each photosensitive resin sho...

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Abstract

The present invention relates to a thinner composition for removing photosensitive resin, and more particularly, to a thinner composition for removing photosensitive resin comprising (a) propylene glycol monoalkyl ether acetate, (b) alkyl ethanoate, and (c) alkyl lactate. By applying the thinner composition for removing photosentive resin according to the present invention on the edges and backsides of glass substrates used in liquid crystal display devices and wafers used in the preparation of semiconductors, it is possible to effectively remove photosensitive resin unnecessarily attached thereto in a short time period. Also, the thinner composition has high safety to the human body and is applicable in various processes by reducing steps at the interface. Further, it can simplify the preparation processes of liquid crystal display devices and semiconductors, thereby economically improving production yields.

Description

technical field [0001] The present invention relates to a thinner composition for removing photosensitive resin, in particular, the present invention relates to a thinner composition for removing photosensitive resin, which not only can effectively remove photosensitive resin in a short time, but also is safe for human body High, can be suitable for a variety of processes, can simplify the liquid crystal display equipment and semiconductor manufacturing process, so that the production yield can be improved economically. The photosensitive resin is an unnecessary photosensitive resin adhered on glass substrates used in liquid crystal display devices and edge and back portions of silicon wafers used in semiconductor manufacturing. Background technique [0002] In the semiconductor manufacturing process, the photolithography process is one of the most important operations. It coats photosensitive resin on the silicon wafer, replicates the pre-designed pattern, and chooses appro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/42G03F7/26G03F7/32H01L21/027
CPCC11D3/044G03F7/0397G03F7/168G03F7/32G03F7/423G03F7/425
Inventor 尹锡壹全雨植朴熙珍
Owner DONGJIN SEMICHEM CO LTD