Semiconductor laser device
A laser device and semiconductor technology, applied in the field of GaAlAs-based compound semiconductor laser devices, can solve the problems of narrow circuit path, insufficient effect of operating voltage, small ridge structure, etc., and achieve the effect of reducing operating voltage and reducing discontinuity
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no. 1 example
[0034] FIG. 1 is a cross-sectional view showing a GaAlAs-based compound semiconductor laser device according to a first embodiment of the present invention.
[0035] The GaAlAs-based compound semiconductor laser device (hereinafter sometimes simply referred to as a semiconductor laser device) has the following structure: an n-type GaAs substrate 10 (doped with Si; 1×10 18 cm -3 ) to form n-type Ga 0.9 al 0.1 As buffer layer 11, n-type Ga 0.5 al 0.5 As cladding layer 12, Ga 0.9 al 0.1 As active layer 13, p-type Ga 0.5 al 0.5 As cladding layer 14, p-type GaAs contact layer 15 and p-type electrode 18a, form n-type electrode 18b on the back surface of substrate 10, by p-type GaAs 0.5 al 0.5 The As cladding layer 14 and the p-type GaAs contact layer 15 form a ridge portion (ridge width: 3 μm), and GaAs current blocking layers 19 are formed on both sides of the ridge portion.
example 1
[0037] The semiconductor laser device having the ridge structure according to the first embodiment described above was manufactured in the following manner.
[0038] First, Ga 0.9 al 0.1 As layer. Here, by adjusting the flow ratio (volume ratio) in the source material gas to AsH 3 Gas: TMG gas: TMA gas: SiH 4 Gas = 50:5:1:10, forming n-type Ga 0.9 al 0.1 As buffer layer, wherein the composition ratio x of Al is 0.1, and the concentration of n conductivity type impurity is 1×10 18 cm -3 , and the film thickness is 70nm.
[0039] Next, adjust the flow ratio (volume ratio) to AsH 3 Gas: TMG gas: TMA gas: SiH 4 Gas = 10:1:1:1, whereby n-type Ga is formed according to the MOCVD method 0.5 al 0.5 As cladding layer 12, wherein the composition ratio x of Al is 0.5, the film thickness is 1 μm, and the concentration of Si is 5×10 17 cm -3 .
[0040] Next, adjust the flow ratio (volume ratio) to AsH 3 Gas: TMG gas: TMA gas = 50:5:1, whereby Ga 0.9 al 0.1 The As active la...
no. 2 example
[0050]3 is a cross-sectional view of a GaAlAs-based compound semiconductor laser device according to a second embodiment of the present invention.
[0051] The GaAlAs-based compound semiconductor laser device has the following structure: an n-type GaAs substrate 20 (doped with Si; 1×10 18 cm -3 ) to form an n-type GaAs buffer layer 26, n-type Ga 0.75 Al 0.25 As buffer layer 21, n-type Ga 0.5 Al 0.5 As cladding layer 22 (doped Si; 5×10 17 cm -3 ), Ga 0.9 Al 0.1 As multi-quantum well active layer 23 (undoped), p-type Ga 0.5 Al 0.5 As cladding layer 24 (doped with Zn; 1×10 18 cm -3 ), p-type GaAs contact layer 25 (doped with Zn; 5×10 18 cm -3 ) and p-type electrode 28, form n-type electrode 28b on the back surface of substrate 20, by p-type Ga 0.5 Al 0.5 The As cladding layer 24 and the p-type GaAs contact layer 25 form a ridge portion (ridge width: 3 μm), and GaAs current blocking layers 29 are formed on both sides of the ridge portion.
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