Crosslinked fluorocopolymer moldings

Abstract

A cross-linked fluorine-containing copolymer moldings applicable to a plasma irradiation step, which is molded as a peroxide cross-linking product of a fluorine-containing copolymer blend comprising a fluorine-containing elastomer copolymer and a fluorine-containing resin copolymer, which is a vinylidene fluoride-tetrafluoroethylene copolymer, both of the copolymers having reaction sites capable of reacting with a common peroxide-based cross-linking agent, respectively, has desired normal state physical properties and compression set value, even if applied to a plasma irradiation step, while reducing particle generation quantity of the fluorine-containing copolymers themselves.Crosslinked fluorocopolymer moldings which are obtained by subjecting a fluorocopolymer blend comprising both a fluoro- elastomer copolymer and a fluororesin copolymer consisting of a vinylidene fluoride / tetrafluoroethylene copolymer which each have reaction sites reactive with a common peroxide-type crosslinking agent to molding and crosslinking and which are subjectable to plasma irradiation. The moldings are reduced in the quantity of particles generated from the fluorocopolymer itself when subjected to plasma irradiation, and exhibit normal-state physical properties and compression set favorable to sealing material.

Description

technical field [0001] The present invention relates to crosslinked fluorocopolymer moldings, and more particularly to crosslinked fluorocopolymer moldings useful in the plasma irradiation step. Background technique [0002] A semiconductor manufacturing method or a liquid crystal manufacturing method involves plasma processing of a silicon wafer in various steps such as a CVD manufacturing step, an etching step, an ashing step, etc., but the plasma processing involves Very harsh conditions, almost all organic polymer materials cannot avoid significant degradation caused by plasma irradiation. [0003] In particular, sealing materials used in semiconductor manufacturing equipment or liquid crystal manufacturing equipment are subject to deterioration by plasma irradiation, and particles of inorganic compounds or the like contained in the sealing material as fillers are generated thereby, and the Such particles will contaminate the wafer surface. Therefore, even sealing mate...

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Problems solved by technology

[0005] These inorganic fillers may be a cause of particles, and it is also speculated that fluoroelastomers do not contain any inorganic fillers to reduce the generation of particles, but in this case, new problems will arise, such as not only difficult for sealing materials Obtain desired normal state physical properties or compression set values ​​and reduce kneadability during mixing