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SnAgCuBi series leadless soldering tin alloy

A lead-free solder and alloy technology, applied in the field of alloys, can solve the problems of cracking of solder joints, damage of electronic products, small solid-liquid coexistence temperature range, etc., to achieve uniform alloy composition, no impurities, high heating efficiency, and good wettability. Effect

Inactive Publication Date: 2007-10-24
上海华实纳米材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It should have a small solid-liquid coexistence temperature range, and it is reasonable to control it within 10°C. If the range is too wide, solder joint cracking may occur and electronic products will be damaged prematurely.

Method used

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  • SnAgCuBi series leadless soldering tin alloy
  • SnAgCuBi series leadless soldering tin alloy
  • SnAgCuBi series leadless soldering tin alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Example 1 The weight percent composition of the SnAgCuBi lead-free solder alloy is: Ag0.1%, Cu0.7%, Bi1.0%, Sb0.01%, Ni0.1%, La0.01%, P0.01% , and the rest are Sn.

[0038] The preparation method of the lead-free solder alloy is as follows: take each raw material according to the above weight percentage, and prepare the intermediate alloy first: configure a graphite crucible in a vacuum intermediate frequency induction melting furnace, put the raw materials into the graphite crucible according to the proportion, close the furnace body, and evacuate , intermediate frequency heating the metal to an appropriate temperature to keep it warm, and finally casting it into a corresponding alloy ingot.

[0039]a. Prepare a Sn-Ag alloy in a vacuum intermediate frequency induction melting furnace with a weight percentage of 70:30, raise the temperature to 1100° C. and keep it warm for 30 minutes, take it out of the furnace, cool and cast it into a tin-silver alloy ingot.

[0040] ...

Embodiment 2

[0049] Example 2 The weight percent composition of the SnAgCuBi lead-free solder alloy is: Ag1.0%, Cu0.5%, Bi2.0%, Sb0.05%, Ni0.05%, La0.01%, P0.01% , the rest is Sn, and the preparation method is the same as in Example 1. The differential scanning calorimetry (DSC) curve during the heating process of the lead-free solder alloy measured by a thermal analysis instrument is shown in Figure 2, and its various performance test data are shown in the table below.

Embodiment 3

[0050] Example 3 The weight percent composition of the SnAgCuBi lead-free solder alloy is: Ag2.0%, Cu0.1%, Bi3.0%, Sb0.1%, Ni0.1%, La0.01%, P0.01% , and the rest are Sn. , the preparation method is the same as in Example 1. The differential scanning calorimetry (DSC) curve during the heating process of the lead-free solder alloy measured by a thermal analysis instrument is shown in Figure 3, and its various performance test data are shown in the table below.

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PUM

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Abstract

The SnAgCuBi lead free solder alloy features in the following weight composition, comprising 0. 1-3. 0% Ag, 0. 1-1. 0% Cu, 0. 1-3. 0% Bi, 0. 01-0. 1% Sb, 0. 01-0. 1% Ni, 0. 005-0. 05% La, 0. 005-0. 05% P, with the rest being Sn. The SnAgCuBi lead free solder alloy does not have any lead, being more environmental protective, with low fuse point, better moisture feature, with anti stretch, flexibility, expansion and creep resistance equal to the tinsel alloy. It is simple in process, low in energy consumption, with the solder alloy even, finer and improved in welding feasibility.

Description

technical field [0001] The invention relates to the field of alloys, in particular to a lead-free solder alloy material. Background technique [0002] With the implementation of the EU WEEE and RoHS directives and the promulgation of domestic electronic product pollution prevention and control measures, the comprehensive lead-free of the domestic electronics manufacturing and solder manufacturing industries will become more and more urgent, and the development of lead-free solder is imperative. . In order to ensure the solderability and post-soldering reliability of lead-free solder, and to take into account issues such as cost, the current research and development and application of lead-free solder mainly face the following problems: (1) The melting point of lead-free solder should be as close as possible to The melting point of 63Sn37Pb alloy is 183°C, roughly between 183°C and 220°C. It should have a small solid-liquid coexistence temperature range, and it is reasonabl...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/03
Inventor 陈跃华林俊
Owner 上海华实纳米材料有限公司
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