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SnAgCuNi series leadless soldering tin alloy

A lead-free solder and alloy technology, applied in the field of alloys, can solve the problems of increasing the production difficulty and cost of PCB boards and electronic components, and achieve the effects of good wettability and low cost

Inactive Publication Date: 2007-10-24
上海华实纳米材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the melting point is too high, higher requirements are placed on the temperature resistance of electronic components and PCB boards, which increases the difficulty and cost of production of PCB boards and electronic components

Method used

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  • SnAgCuNi series leadless soldering tin alloy
  • SnAgCuNi series leadless soldering tin alloy
  • SnAgCuNi series leadless soldering tin alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1 SnAgCuNi lead-free solder alloy, its weight percent composition: 1.5% of Ag, 0.5% of Cu, 0.5% of Ni, 0.01% of Bi, 0.01% of P, and the balance of Sn and unavoidable of impurities. Its preparation method is as follows: first take the raw materials according to the following weight: 1.5 parts by weight of Ag, 0.5 parts by weight of Cu, 0.5 parts by weight of Ni, 0.01 parts by weight of Bi, 0.01 parts by weight of P, and 97.28 parts by weight of Sn.

[0031] The Sn-Ag alloy was prepared in a vacuum intermediate frequency induction melting furnace with a weight percentage ratio of 70:30, the temperature was raised to 1100°C and kept for 30 minutes, and the tin-silver alloy ingot was cast out of the furnace for cooling.

[0032] The Sn-Cu alloy was prepared in a vacuum intermediate frequency induction melting furnace with a weight percentage ratio of 70:30, the temperature was raised to 1200°C and kept for 30 minutes, and the tin-copper alloy ingot was cast out of t...

Embodiment 2

[0038] Example 2 The weight percent composition of the lead-free solder alloy is: 2.0% Ag, 0.5% Cu, 0.01% Ni, 0.01% Bi, 0.01% P, and the balance of Sn and unavoidable impurities, Its preparation method is with embodiment 1.

[0039] Adopt thermal analysis instrument to carry out thermal analysis to the lead-free solder alloy of preparation, obtain differential scanning calorimetry (DSC) curve and see accompanying drawing 2, find out from the figure, in the melting temperature of this lead-free solder alloy, solidus and The liquidus temperatures are 220.3°C and 221.8°C, respectively. The solder alloy is used for PCB component welding experiments, and has good wetting properties and oxidation resistance, and its mechanical properties are superior to the existing national standards for lead-containing solder alloys.

Embodiment 3

[0040] Embodiment 3 The weight percent composition of the lead-free solder alloy is: 2.0% Ag, 0.5% Cu, 0.2% Ni, 0.01% P, and the balance of Sn and unavoidable impurities. Its preparation method is the same as in Example 1, and no Sn-Bi intermediate alloy is added to the solder alloy.

[0041]Adopt thermal analysis instrument to carry out thermal analysis to the lead-free solder alloy of preparation, obtain differential scanning calorimetry (DSC) curve and see accompanying drawing 3, find out from the figure, in the melting temperature of this lead-free solder alloy, solidus and The liquidus temperatures are 221.8°C and 223.3°C, respectively. The solder alloy is used for circuit component welding experiments, and has good wetting performance and oxidation resistance, and its mechanical properties are superior to the existing national standards for lead-containing solder alloys.

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Abstract

The SnAgCuNi tinsel features n the weight composition of 1. 5-2. 5% Ag, 0. 1-0. 8% Cu, 0. 01-0. 5% Ni, 0. 001-0. 1% P, 0-0. 01% Bi with the rest being Sn and unavoidable impurities. The SnAgCuBi lead free solder alloy does not have any lead, being more environmental protective, with low fuse point, better moisture feature, with anti stretch, flexibility, expansion and creep resistance equal to the tinsel alloy.

Description

technical field [0001] The invention relates to the field of alloys, in particular to a lead-free solder alloy. Background technique [0002] With the implementation of the EU WEEE and RoHS directives and the promulgation of domestic electronic product pollution prevention and control measures, the comprehensive lead-free of the domestic electronics manufacturing and solder manufacturing industries will become more and more urgent, and the development of lead-free solder is imperative. . In order to ensure the solderability and post-soldering reliability of lead-free solder, and to take into account issues such as cost, the current research and development and application of lead-free solder mainly face the following problems: (1) The melting point of lead-free solder should be as close as possible to The melting point of 63Sn37Pb alloy is 183°C, roughly between 183°C and 220°C. If the melting point is too high, higher requirements are placed on the temperature resistance ...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/03
Inventor 陈跃华林俊
Owner 上海华实纳米材料有限公司
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