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Polyimide, polyimide film and laminated body

A polyimide film, polyimide technology, applied in the direction of layered products, transportation and packaging, metal layered products, etc., can solve the problems of not easy application, expensive starting materials, etc. The effect of sealing performance and moisture permeability rate, maintaining heat resistance, and high elastic modulus

Inactive Publication Date: 2007-11-07
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this starting material is expensive and cannot be easily applied to industrial applications

Method used

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  • Polyimide, polyimide film and laminated body
  • Polyimide, polyimide film and laminated body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0071] According to the ratio shown in Table 1, mix solution 1 and solutions 2-6, coat each mixture on a glass panel to a final film thickness of about 25 microns, and heat at 135°C for 3 minutes to form a solidified film. Peel in panel, then spread on pin tenter and heat at 130°C for 5 minutes, 180°C for 5 minutes, 210°C for 5 minutes and 320°C for 2 minutes, after that, within 5 minutes The temperature was increased to 450° C. and kept at 450° C. for 2 minutes for heat treatment to obtain a polyimide film. Under a dry nitrogen atmosphere, the resulting polyimide film was dried to a constant weight, and immersed in purified water at 23° C. for 24 hours, and after wiping the adherend with water, saturated water absorption was measured from a change in weight. Next, under a dry nitrogen atmosphere, the obtained polyimide film was dried to a constant weight, and then the weight change at 27° C., 55% RH was measured to determine a relative moisture absorption rate. In addition, ...

Embodiment 6-15

[0079] According to the ratio shown in Table 2, mix solution 1 and solution 3, and then coat each mixture on a glass panel to a final film thickness of 25 microns and 50 microns, and heat at 135 ° C for 3 minutes (final thickness: 25 μm) or 5 minutes (final thickness: 50 μm), a solidified film was formed, peeled from the glass panel, and spread on a pin tenter, and heated at 130°C for 5 minutes, and at 180°C for 5 minutes, After heating at 210° C. for 5 minutes and 320° C. for 2 minutes, the temperature was increased to 450° C. within 5 minutes and kept at 450° C. for 2 minutes for heat treatment to obtain a polyimide film. Under a dry nitrogen atmosphere, the resulting polyimide film was dried to a constant weight, and immersed in purified water at 23° C. for 24 hours, and after wiping the adherend with water, saturated water absorption was measured from a change in weight. Next, under a dry nitrogen atmosphere, the obtained polyimide film was dried to a constant weight, and ...

Embodiment 13

[0084] Coat solution 1 on the glass panel to a final thickness of about 21 microns, and heat at 135°C for 3 minutes to form a solidified film (base layer), and then coat side A by mixing solution 1: solution 3 = 90 : 10 (molar ratio) and adjusted to a monomer concentration of 5 wt % to obtain a polyimide precursor solution into a final film thickness of 2 micrometers, and heated at 135° C. for 1 minute, after which it was peeled off from the glass panel, Then, side B was coated in the same manner, and heated at 135° C. for 1 minute, and the solidified film was peeled off from the glass panel. The film was then spread out on a pin tenter and heated at 130°C for 5 minutes, 180°C for 5 minutes, 210°C for 5 minutes and 320°C for 2 minutes, after which the temperature was increased to 450° C., and kept at 450° C. for 2 minutes for heat treatment to obtain a polyimide film. The layer thickness of the obtained three-layer polyimide film was 2 μm / 21 μm / 2 μm. Under a dry nitrogen atm...

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Abstract

A novel polyimide wherein a tetracarboxylic dianhydride comprising 3,3',4,4'-biphenyltetracarboxylic dianhydride as the essential component is the starting tetracarboxylic dianhydride component, and an amine comprising between 0.5 and 30 mole percent of a diamine represented by the following general formula is the starting diamine component. (wherein A is a direct bond or a crosslinking group, and R1-R4 each represent a substituent). It is possible to obtain a polyimide, a polyimide film and a laminated body with an improved adhesion property and an improved moisture permeation rate, even without surface treatment, comprising, as the essential tetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride which has conventionally only yielded polyimides with low adhesive strength.

Description

technical field [0001] The present invention relates to novel polyimides, polyimide films and laminates, and more particularly, the present invention relates to polyimides having high moisture transmission rates and improved adhesion, wherein the starting tetra The carboxylic dianhydride component is tetracarboxylic dianhydride containing 3,3`,4,4`-biphenyltetracarboxylic dianhydride as a basic component, and the starting diamine component is containing Aromatic diamine as a diamine as an essential component, and a polyimide film having a polyimide layer composed of polyimide on at least one side, and a laminate thereof. Background technique [0002] As 3,3',4,4'-biphenyltetracarboxylic dianhydride-based polyimide (which gives heat-resistant polyimide), containing 3,3',4,4'-biphenyltetracarboxylic Acid dianhydride and p-phenylenediamine are known as polyimides of a starting carboxylic dianhydride component and a starting diamine component, respectively, and they give a low ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCY10T428/31681H05K1/0346Y10T428/31678Y10T428/12569C08G73/1042C08G73/1067C08G73/1071Y10T428/31721B32B15/08C08G73/10C08J5/18
Inventor 山口裕章村上真人幸田政文
Owner UBE IND LTD
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