Double platform system for rotary exchange

Abstract

The invention provides a rotating dual-exchange system. The technology in the two-station system has complex structures, and the high costs and dual-exchange potential safety problems when there are problems. The invention of the rotary dual-exchange system for one of the main frame and has operations in the two electronic devices, including set up its main base on the framework of the operations of the two should be installed in the symmetry and the stage - The first and second operations desk, base stations used to drive along the base of the center-rotating drives used to control devices and base stations driven deviser base rotation in order to achieve the first - and second operation Taiwan transposition operation control module. By the invention of the rotary dual-exchange system can improve the efficiency and reduce costs.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing equipment, in particular to a dual-stage system with rotary exchange. Background technique [0002] Photolithography is to transfer the chip pattern on the reticle to the silicon wafer through a photolithography machine. It is an important process in semiconductor manufacturing. Therefore, the efficiency and quality of photolithography have an important impact on the manufacturing efficiency and quality of semiconductor chips. [0003] Early lithography machines usually used a single worktable, and the alignment measurement and subsequent exposure in lithography were performed on the single workbench. The lithography machine with a single workbench can only lithography one silicon wafer at a time. The exposure process of the silicon wafer can only be performed after the alignment measurement of the scanning exposure area is completed, so the production efficiency of the photolithography ...

AI Technical Summary

Problems solved by technology

[0007] However, the European Patent No. WO98 / 40791 also has some problems: because each workbench and the drive unit adopt a coupling connection method, in the exchange process, the coupling connection seat and the workbench need to be separated briefly, and the two After the separation, though the clamping of the positioning device (the European Patent No. WO98 / 28665 and the U.S. Patent No. US6498350 all describe the positioning device in detail) by the positioning device ensures that the separation position is fixed, the separation of the two It will still affect the positioning accuracy of the system

However, there is also a problem with this dual-stage technology, that is, the vibration problem that occurs during the leveling and focusing process of the cantilevered wafer table needs to be overcome, and a special design of the silicon wafer jacking and pressing device is required

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