Double platform system for rotary exchange

A dual-stage, base-stage technology, applied in the field of semiconductor manufacturing equipment, can solve problems such as the influence of system positioning accuracy, and achieve the effect of simplifying the structure and saving costs

Active Publication Date: 2007-11-14
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
View PDF6 Cites 60 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the European Patent No. WO98/40791 also has some problems: because each workbench and the drive unit adopt a coupling connection method, in the exchange process, the coupling connection seat and the workbench need to be separated briefly, and the two After the separation, though the clamping of the positioning device (the European Patent No. WO98/28665 and the U.S. Patent No. US6498350 all describe the positioning device in d...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double platform system for rotary exchange
  • Double platform system for rotary exchange
  • Double platform system for rotary exchange

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] The dual-stage system for rotary exchange of the present invention will be further described in detail below.

[0042] Referring to Fig. 1, it shows the schematic structural diagram of the first embodiment of the dual-stage system of rotary exchange of the present invention, as shown in the figure, the dual-stage system of rotary exchange is used in a photolithography machine, and the rotary The exchanged dual-table system includes a base 10, a base driving device 11, a base locking unit 12, a first workbench 13, a second workbench 14, a control module 15, and a deceleration module 16, wherein the lithography machine It includes a main frame 20 , an alignment measurement module 21 , an exposure module 22 , a loading module (not shown), and a loading module (not shown).

[0043]The main frame 20 includes a U-shaped bracket 20a, a plurality of shock-absorbing structures 20b evenly distributed on the bottom of the U-shaped bracket, and a support platform 20c arranged on th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a rotating dual-exchange system. The technology in the two-station system has complex structures, and the high costs and dual-exchange potential safety problems when there are problems. The invention of the rotary dual-exchange system for one of the main frame and has operations in the two electronic devices, including set up its main base on the framework of the operations of the two should be installed in the symmetry and the stage - The first and second operations desk, base stations used to drive along the base of the center-rotating drives used to control devices and base stations driven deviser base rotation in order to achieve the first - and second operation Taiwan transposition operation control module. By the invention of the rotary dual-exchange system can improve the efficiency and reduce costs.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing equipment, in particular to a dual-stage system with rotary exchange. Background technique [0002] Photolithography is to transfer the chip pattern on the reticle to the silicon wafer through a photolithography machine. It is an important process in semiconductor manufacturing. Therefore, the efficiency and quality of photolithography have an important impact on the manufacturing efficiency and quality of semiconductor chips. [0003] Early lithography machines usually used a single worktable, and the alignment measurement and subsequent exposure in lithography were performed on the single workbench. The lithography machine with a single workbench can only lithography one silicon wafer at a time. The exposure process of the silicon wafer can only be performed after the alignment measurement of the scanning exposure area is completed, so the production efficiency of the photolithography ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G03F7/20H01L21/027B23Q1/25B23Q11/00
Inventor 王天明袁志扬严天宏
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products