Conductive adhesive

A technology of adhesives and conductive fillers, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., to achieve moderate bonding strength, low cost, and improved bonding strength

Inactive Publication Date: 2007-12-05
NO 53 RES INST OF CHINA NORTH IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patents for conducting adhesives for bonding electromagnetic shielding materials prepared directly from polybutadiene liquid rubber with active end groups as the base material of the adhesive have not yet been retrieved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Mechanically stir 110 grams of carboxy-terminated polybutadiene liquid rubber with a molecular weight of 2000-2500, 50 grams of ethyl acetate and 1.0 grams of Deqian 28100; 600 grams of silver-copper powder, mechanically stirred for 15 minutes until the system was fully dispersed and uniform, and the adhesive A component was obtained.

[0040] 10 g of diphenylmethane-4,4'-diisocyanate and 0.003 g of catalyst triethylenediamine were uniformly mixed to obtain component B of the adhesive.

[0041] Fully mix components A and B evenly, apply a uniform film layer with a thickness of 0.3mm on the ABS material sheet, and cure at room temperature for 4 hours. Use the electric four-probe method to measure the sheet resistance of the colloid, and further calculate the volume resistivity of the colloid. 9 ×10 -4 Ω.cm. At room temperature (20°C) (executive standard is GB7124-1986) the tensile shear strength is 2.51MPa, and the tensile shear strength at -50°C is 5.04MPa (executive ...

Embodiment 2

[0043] Mechanically stir 100 grams of hydroxyl-terminated polybutadiene liquid rubber with a molecular weight of 2300-2500, 45 grams of ethyl acetate and 28100.6 grams of Deqian; add dendritic silver plating with an average particle size of 5-10 μm and a silver plating amount of 25%. 450 grams of copper powder, mechanically stirred for 15 minutes until the system is fully dispersed and uniform, and the adhesive A component is obtained.

[0044] 7 grams of tolyl diisocyanate and 0.006 grams of catalyst dibutyltin dilaurate were mixed evenly to obtain component B of the adhesive.

[0045]Mix components A and B thoroughly, and cure at room temperature for 8 hours. Sample preparation and test method are the same as in Example 1, and the volume resistivity is 1.1×10 -3 Ω.cm, the tensile shear strength at room temperature (20°C) is 2.66MPa, and the tensile shear strength at -50°C is 5.52MPa.

Embodiment 3

[0047] Mechanically stir 50 grams of carboxyl-terminated polybutadiene liquid rubber with a molecular weight of 4500-5000, 50 grams of carboxyl-terminated polybutadiene liquid rubber with a molecular weight of 1500-2000, and 45 grams of dimethyl carbonate; , 400 grams of flaky silver-plated copper powder with a silver plating amount of 20%, mechanically stirred for 15 minutes until the system was fully dispersed and uniform, and the adhesive A component was obtained.

[0048] 10 g of polymethylene polyphenyl polyisocyanate and 0.01 g of catalyst N, N-dimethylcyclohexylamine were uniformly mixed to obtain component B of the adhesive.

[0049] Mix components A and B thoroughly, and cure at room temperature for 1 hour. Sample preparation and test method are the same as in Example 1, and the volume resistivity is 7.0×10 -3 Ω.cm, the tensile shear strength at room temperature (20°C) is 3.07MPa, and the tensile shear strength at -50°C is 6.01MPa.

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Abstract

The present invention relates to conductive adhesive, and is especially one kind of conductive adhesive for adhering electromagnetic shielding material. The conductive adhesive has polybutadiene liquid rubber containing active end group as the base material, silver coated powder as the conductive stuffing and other assistants. Having low resistivity, moderate adhesion strength, certain elasticity and cold resistance, and low cost, the conductive adhesive may be applied widely in adhering electromagnetic shielding material, especially of great adhered area.

Description

1. Technical field [0001] The invention relates to the technical field of bonding, in particular to the technical field of conductive adhesives, and further relates to the conductive adhesive for bonding electromagnetic shielding materials. 2. Background technology [0002] Compared with the current Pb-Sn solder used in electronic packaging, conductive adhesive has environmental friendliness (does not contain harmful substances such as Pb), loose process conditions (lower construction temperature) and less process, so it is used in electronic packaging And electromagnetic shielding and other fields have broad application prospects. [0003] Conductive adhesives are generally composed of matrix materials, conductive fillers and other additives. They are mainly used in semiconductor manufacturing and packaging of microelectronic devices. In the bonding of integrated circuit chips and substrates or circuit components and printed circuit boards, not only conductive adhesives are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J109/00C09J11/04
Inventor 孙建生徐勤涛杨丰帆
Owner NO 53 RES INST OF CHINA NORTH IND GRP
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