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Solder paste and electronic device

A technology for solder paste and electronic components, which is applied in the direction of assembling printed circuits with electrical components, welding equipment, printed circuits, etc., can solve the problems of reduced bonding strength between the printed circuit board 107 and the chip-type electronic components 108, and achieves improved bonding strength, Large surface area, the effect of promoting the reaction

Active Publication Date: 2007-12-12
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Therefore, after the first reflux treatment, in the state where a large amount of unreacted Sn components remain, if the second reflux treatment is performed at a temperature of 250° C. or higher as the melting point of the Sn component, the first reflux treatment will The unreacted Sn111 in the joined solder melts again, and as a result, the joint strength of the printed circuit board 107 and the chip-type electronic component 108 joined by the first reflow process decreases.

Method used

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  • Solder paste and electronic device
  • Solder paste and electronic device
  • Solder paste and electronic device

Examples

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Effect test

no. 1 example

[0074] As the first metal material to be the metal base material, Cu powder with an average particle size of 1 μm (hereinafter referred to as "base material Cu") (melting point: 1083°C) is prepared, and electroless Sn plating or electroless plating is performed on the base material Cu. In. Then, by this electroless Sn plating or electroless In plating, a Sn film or an In film (second metal material) with a film thickness of 0.5 μm was formed on the surface of the base material Cu, thereby producing a first metal powder.

[0075] Next, as the second metal powder, Sn powder (melting point: 231°C) and In powder (melting point: 156°C) with an average particle size of 1 μm were prepared, and as the third metal powder, Cu powder with an average particle size of 0.01 μm was prepared. powder.

[0076] In addition, flux having a compounding ratio of rosin: 76% by weight, diethylene glycol diethyl ether: 22% by weight, and triethanolamine: 2% by weight was prepared.

[0077] Next, wei...

no. 2 example

[0087] As the first metal material to be the metal base material, base material Cu with an average particle diameter of 1 μm and Ag powder with an average particle diameter of 1 μm (hereinafter referred to as “base material Ag”) (melting point: 961° C.) were prepared. Next, electroless Sn plating (Examples 11 to 13 and Examples 17 to 19) or electroless In plating (Examples 14 to 16 and Examples 20 to 22) was performed on the base material Cu or the base material Ag. Then, by this electroless Sn plating or electroless In plating, a Sn film or an In film (second metal material) with a film thickness of 0.5 μm is formed on the surface of the base material Cu or the base material Ag, thereby producing the first metal powder.

[0088] Next, as in the first example, second metal powder (Cu powder or In powder) with an average particle diameter of 1 μm and Cu powders with average particle diameters of 0.01 μm, 0.30 μm, and 1.00 μm were prepared. Then, the first metal powder, second m...

no. 3 example

[0097] As the first metal material, Ag powder (melting point: 961°C), Au powder (hereinafter referred to as "base material Au") (melting point: 1064°C), Pd powder (hereinafter referred to as "base material Au"), and Pd powder (hereinafter referred to as "base material Au") with an average particle size of 1 μm were used. Material Pd") (melting point: 1554°C), as the third metal powder, Ag powder, Au powder, and Pd with an average particle size of 0.01 μm were used to produce an implementation with Table 3 in the same steps as (first embodiment) Solder paste with the compounding ratio shown in Examples 31 to 48.

[0098] In addition, predetermined amounts of the above-mentioned first metal powder and the above-mentioned second metal powder were weighed, and the first metal powder and the second metal powder were dispersed in the flux to prepare solders of Comparative Examples 31 to 36 that did not contain the third metal powder. solder paste.

[0099] Next, the multilayer cera...

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Abstract

In the solder paste of the present invention, the following metal powders are dispersed in a flux or a thermosetting resin: a first metal material such as Cu, Ag, Au, and Pb is used as a base material, and Sn and In, which have a lower melting point than the first metal material, are mixed A first metal powder in which a metal material such as the first metal material adheres to the surface of the first metal material; a second metal powder composed of a metal material such as Sn and In, which has a lower melting point than the first metal material; the average particle size is smaller than that of the first metal material A third metal powder such as Cu, Ag, Au, and Pd that is small and can be combined with the second metal material and the second metal powder. Thereby, the unreacted components can be suppressed from remaining after the heat treatment, and even if the reflow treatment is repeated a plurality of times, the decrease in the bonding strength of the solder joint caused by this can be avoided.

Description

technical field [0001] The present invention relates to a solder paste and an electronic device, and more specifically relates to a Pb-free solder paste that does not contain Pb and an electronic device manufactured therewith. Background technique [0002] As solder materials used for mounting electronic components, environmental considerations have been taken into account in recent years. From the existing Sn-Pb system to Pb-free Pb-free solder materials such as Sn-Cu eutectic system and Sn-Ag eutectic system, etc. The development of solder materials prevails. [0003] For example, Patent Document 1 proposes a solder having Cu solder balls and Sn solder balls, in which a part of the Cu solder balls and the Sn solder balls form a solder containing Cu solder above the melting point of Sn. 6 sn 5 compound, between Cu solder balls becomes to be containing Cu 6 sn 5 state of compound binding. [0004] Patent Document 1 discloses a solder paste, as shown in FIG. ) 105 is Sn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22H05K3/34
CPCB23K35/0244B23K35/025B23K35/226B23K35/262B23K35/3006B23K35/3013B23K35/302B23K35/3613B23K35/362H05K3/3463H05K3/3484H05K2201/0218H05K2201/0272H05K3/3485
Inventor 高冈英清中野公介
Owner MURATA MFG CO LTD