Gold plating solution, and method for plating gold

A technology of gold plating solution and gold salt, applied in the field of gold plating solution and its gold plating

Inactive Publication Date: 2007-12-26
SUZHOU UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But with the gold-containing salt Au(PPh 3 )Cl or Au(PPh 3 ) Br room temperature ionic liquid [bmim]BF 4 or [bmim]PF

Method used

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  • Gold plating solution, and method for plating gold
  • Gold plating solution, and method for plating gold
  • Gold plating solution, and method for plating gold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Example 1: In a 25ml single-chamber electrolyzer, add 0.05 grams of Au(PPh 3 )Cl and 10ml ionic liquid [bmim]BF 4 , The temperature was raised to 80°C to fully dissolve the gold salt in the ionic liquid. Using the gold salt-containing ionic liquid as electrolyte, direct current electroplating, using gold sheet (10mm×12mm, purity of 99.9%) as anode, copper sheet (12mm×14mm, purity of 99.5%) as cathode, and the cathode and anode are Aligned vertically, the electrode surfaces are parallel to each other, stirring, current density 0.08A / dm 2 , The cell voltage is 1.8~2.0V, the pole pitch is 10mm, and the plating temperature is 80℃. A bright gold coating was obtained after 2 hours of electrification. See Figure 1 and Figure 2 for the effect.

Embodiment 2

[0026] Example 2: In a 25ml single-chamber electrolyzer, add 0.05 grams of Au(PPh 3 )Cl and 10ml ionic liquid [bmim]BF 4 , The temperature was raised to 90°C to fully dissolve the gold salt in the ionic liquid. Using the gold salt-containing ionic liquid as electrolyte, direct current electroplating, using gold sheet (10mm×12mm, purity of 99.9%) as anode, nickel sheet (8mm×10mm, purity of 99.5%) as cathode, the cathode and anode are Aligned vertically, the electrode surfaces are parallel to each other, stirring, current density 0.18A / dm 2 , The cell voltage is 1.8~2.0V, the pole distance is 15mm, and the plating temperature is 90℃. A bright gold coating was obtained after 2 hours of electrification.

Embodiment 3

[0027] Example 3: In a 25ml single-chamber electrolyzer, add 0.05 grams of Au(PPh 3 )Cl and 10ml ionic liquid [bmim]PF 6 , The temperature was raised to 90°C to fully dissolve the gold salt in the ionic liquid. Using the gold salt-containing ionic liquid as electrolyte, direct current electroplating, using gold sheet (10mm×12mm, purity of 99.9%) as anode, copper sheet (12mm×14mm, purity of 99.5%) as cathode, and the cathode and anode are Aligned vertically, the electrode surfaces are parallel to each other, stirring, current density 0.05A / dm 2 , Cell voltage 2.0~2.3V, pole distance 10mm, electrolysis temperature 90℃. A bright gold coating was obtained after 2 hours of electrification.

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PUM

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Abstract

This invention discloses a gold-plating solution and gold-plating method. The method comprises: utilizing gold salt-containing room temperature ionic liquid as the gold-plating solution, gold as the anode, and material to be plated as the cathode, and performing DC electrolysis to reduce the cathode and obtain a shinning gold plating layer. The gold salt is Au (PPh3) Cl or Au (PPh3) Br; the room temperature ionic liquid is [bmim] BF4 or [bmim] PF6; the concentration of the gold salt in the ionic liquid is 0.005 mol/L to saturation concentration. The gold-plating solution does not contain hypertoxic cyanide, and has such advantages as high stability in air and water, no volatility, low flammability, and no harm to environment or operators.

Description

Technical field [0001] The invention relates to a gold plating solution and a gold plating method thereof, and more specifically, to a method of electroplating gold in the room temperature ionic liquid by using a room temperature ionic liquid containing gold salt as the gold plating solution. Background technique [0002] Gold has a beautiful color, good ductility, electrical and thermal conductivity, high chemical stability, high temperature resistance, and corrosion resistance. Therefore, it is often plated on the surface of some parts and meters to give it some special functions. Electrical appliances, electronic components, defense technology and decoration are widely used. [0003] Gold plating usually adopts water system, in alkaline cyanide bath and acid-neutral buffer system micro cyanide bath. The significant drawback of this gold plating technique is the use of cyanide. Cyanide is a highly toxic substance, which not only affects the health of operators, but also causes ...

Claims

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Application Information

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IPC IPC(8): C25D3/48
Inventor 顾建胜陆文娟于爱风李栋强
Owner SUZHOU UNIV
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