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Against corrosion film stripper composition

A technology of composition and stripping agent, applied in detergent compositions, surface-active detergent compositions, inorganic non-surface-active detergent compositions, etc., can solve problems such as corrosion of metal wiring and easy change of ingredients

Active Publication Date: 2007-12-26
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the primary or secondary amines have the disadvantages that the composition is easily changed due to the low boiling point, and the weight and composition change after a period of time due to volatilization, thus bringing the inconvenience of needing to replace the entire stripping solution during the process
In addition, when the primary or secondary amine does not contain a corrosion inhibitor, metal wiring can be severely corroded even if mixed with a small amount of water

Method used

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  • Against corrosion film stripper composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0051]Experiment 1 and Experiment 2 were carried out to select amines and corrosion inhibitors, and the test pieces used in the experiments are as follows.

[0052] Test pieces used in Experimental Example 1 and Experimental Example 2 (test piece 1, test piece 2)

[0053] First, test pieces for evaluating the corrosion ability to metals were prepared in the following manner. That is, after forming a thin film (fim formation) of aluminum (aluminum), molybdenum (molybdenum), and copper (copper) with a thickness of about 2000 Ȧ on the glass surface, a resist film is applied and developed to prepare a test piece 1 .

[0054] Second, a test piece for evaluation of resist stripping performance was prepared in the following manner. That is, after forming a thin film of chromium (Cr) on the glass surface, a resist film is applied, wet etching is performed, and dry etching gas is supplied to form n+a-Si: H activation film (active film) test piece 2. In addition, in order to form a...

experiment example 1

[0056] Using test piece 2 and test piece 3, the resist stripping performance of a single raw material was evaluated; and using test piece 1, the corrosion ability of aluminum, molybdenum and copper was evaluated, and the results are shown in Table 1.

[0057] [Table 1]

[0058] evaluation on metal

Membrane Corrosion Degree

Stripping performance of resist film

aluminum

molybdenum

copper

70°C, soak for 20 minutes

70℃, impregnated

30 seconds (test piece

3)

70℃, impregnated

30 seconds (test piece

2)

Monoethanolamine

×

×

×

1-(2-Hydroxyethyl)piperazine

1-(2-Aminoethyl)piperazine

×

1-(2-Hydroxyethyl)-4-methylpiperazine

N-(3-Aminopropyl)morpholine

×

2-Methylpiperazine

...

experiment example 2

[0066] As shown in Table 2, test piece 1 was used to test the corrosion resistance of monoethanolamine and various amines used in the present invention to metal. For the amines that had a problem with the resist film peeling performance in the independent evaluation, experiments were conducted using two kinds of amines. In addition, since there are some corrosion phenomena for each metal in the above-mentioned independent evaluation, a compound containing 45 wt% of glycol ether, 45 wt% of polar solvent diethylene glycol butyl ether and 10% of two or one amines is used. The solution was tested and the results are shown in Table 2.

[0067] [Table 2]

[0068] Corrosion degree of metal wiring

aluminum

molybdenum

copper

Monoethanolamine

×

1-(2-Hydroxyethyl)piperazine

1-(2-Aminoethyl)piperazine

×

N-(3-Aminopropyl)morpholine

...

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Abstract

The invention relates to a photoetch-resist film used for removing the pattern of the electronic circuit or display element, a photoetch-resist film remover composition for inhibiting the corrosion to the metal wiring. The photoetch-resist film remover composition optimally comprising: a) diamine compound of 1-20 wt.%; and residual glycol ether compound. The invention may further comprise the polar solvent. The photoetch-resist film remover composition will not corrode the metal wiring in the process of removing the photoetch-resist film.

Description

technical field [0001] The present invention relates to a stripper composition for removing a resist film (resist) used in photolithography (photo-lithography), and more particularly to a stripper composition capable of removing a resist film used for patterning metal wiring. A resist film stripper composition that reduces corrosion to metal wiring and can achieve an excellent stripping effect. Background technique [0002] Usually, resist film (photoresist film, photo-resist) is an essential substance in photolithography process, and photolithography process is generally applied to integrated circuit (integrated circuit, IC), large-scale integrated circuit Manufacturing of semiconductor devices such as large scale integration (LSI) and very large scale integration (VLSI) and image display devices such as liquid crystal displays and flat panel displays. [0003] However, after performing a photo-lithography process, the resist film is removed by a stripping solution at high...

Claims

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Application Information

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IPC IPC(8): G03F7/42
CPCC11D1/526C11D3/044C11D3/2068C11D7/10G03F7/322G03F7/422G03F7/425G03F7/426
Inventor 金圣培尹锡壹郑宗铉许舜范朴熙珍辛成健郑世桓许铉金柄郁
Owner DONGJIN SEMICHEM CO LTD
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