Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ink jet printing head and its producing method

A printing head and inkjet technology, applied in the field of inkjet printing head and its manufacturing, can solve the problems of poor adhesion between the chamber layer and the wafer, and achieve the effect of improving the poor adhesion and improving the compatibility.

Inactive Publication Date: 2008-01-30
INT UNITED TECH
View PDF2 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an inkjet printing head, which can improve the problem of poor adhesion between the chamber layer and the wafer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ink jet printing head and its producing method
  • Ink jet printing head and its producing method
  • Ink jet printing head and its producing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0051] FIG. 1 is a schematic cross-sectional view of an inkjet printhead according to a first embodiment of the present invention.

[0052] Please refer to FIG. 1 , the inkjet print head of the first embodiment includes a chip (chip) 100, a chamber layer 104 and a nozzle layer 106, wherein the chip 100 has an actuating device 102, and the chamber layer 104 is disposed on the chip 100 , while the nozzle layer or nozzle plate 106 is disposed on the chamber layer 104 . Wherein, the chamber layer 104 generally has a plurality of chambers 105 , and the chambers are located above the actuating device 102 . In a preferred embodiment, the chamber layer 104 has a plurality of channels 107 respectively connected to the chambers. In a preferred embodiment, if the actuating device 102 is a heating element (heater; resistive element; or electric heating element), it will be covered with other protective layer (not shown), such as SiN layer, SiC layer or stack of SiN and SiC. Therefore, ...

no. 2 example

[0055] 2A-1, FIG. 2A-2 to FIG. 2C are schematic cross-sectional views of the manufacturing process of an inkjet printhead according to the second embodiment of the present invention, and the inkjet printhead produced in the second embodiment is the same as that in the first embodiment The difference of the example is that there is an additional first material layer between the chamber layer and the nozzle layer.

[0056] Please refer to FIG. 2A-1 and FIG. 2B first, a wafer 200 having a plurality of actuating devices 202 is provided, and the actuating devices 202 can be electric heating elements or piezoelectric elements. Afterwards, a double-layer structure is formed on the wafer 200 , which includes a chamber layer 204 in contact with the surface of the wafer 200 and a first material layer 205 not in contact with the surface of the wafer 200 . Therefore, the method shown in FIG. 2A-1 can be chosen to firstly form an organic solvent-developable acrylic negative photoresist (ie...

no. 3 example

[0060] 3A to 3B are schematic cross-sectional views of the manufacturing process of an inkjet printhead according to the third embodiment of the present invention, and the difference between the inkjet printhead manufactured in the third embodiment and the first embodiment is that it is located in the chamber There is also a second material layer between the layer and the nozzle layer.

[0061] Referring first to FIG. 3A , a wafer 300 having a plurality of actuating devices 302 is provided, and the actuating devices 302 may be electric heating elements or piezoelectric elements. Afterwards, a chamber layer 304 is formed on the wafer 300 . This chamber layer 304 has a plurality of chambers 305 and a plurality of flow channels 307 respectively connected to the chambers 305, and the chambers are located above the actuating device 302, and the material of the chamber layer 304 is organic solvent-developable acrylic It is a negative photoresist, and the preferred material is an or...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an ink injection print head which comprises at least a wafer, a chamber layer and a nozzle layer; wherein, the wafer is provided with a plurality of actuators; the chamber layer is arranged on the wafer; the nozzle layer is arranged on the chamber layer which is provided with a plurality of chambers; the chambers are arranged above the actuators; the material of the chamber layer is an organic solvent developed acrylic acid negative-typed photoresist. Furthermore, the nozzle layer is provided with a plurality of nozzles which are respectively communicated with the chambers; the material of the nozzles is the epoxy-typed or acyl imino group-typed negative-typed photoresist.

Description

technical field [0001] The present invention relates to an inkjet print head (inkjet print head) and its manufacturing method, in particular to an inkjet print head capable of improving the adhesion between a chip (chip) and a chamber layer (chamber layer) and the same Manufacturing method. Background technique [0002] In recent years, driven by the development of high-tech industries, all electronics-related industries have advanced by leaps and bounds. As far as printers are concerned, in just a few years, printing technology has progressed from early dot matrix printing and monochrome laser printing to current color inkjet printing and color laser printing. As far as inkjet printers are concerned, the printing technologies currently used in inkjet printers on the market mainly include thermal bubble or piezoelectric inkjet technologies, which are used to spray ink onto recording media. Such as paper, etc., thus forming characters or patterns on the surface of the recor...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14B41J2/16
Inventor 蔡尚颖李致淳江逊旌
Owner INT UNITED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com