Curing agent intermediate composition and curing agent employing the same

Abstract

The invention provides a curing agent intermediate composite for preparing latent curing agent, comprising a first masterbatch and a second masterbatch, wherein, the first masterbatch is an addition product masterbatch obtained from the reaction of E-51 epoxy resin and 2-methylimidazole, the second masterbatch is the addition product masterbatch obtained from the reaction of bisphenol A epoxy resin and 2-phynelimidazol. The curing agent intermediate composite comprises 25wt percent -75wt percent of the first masterbatch and 25wt percent-75wt percent of the second masterbatch. The invention further provides a curing agent based on the curing agent intermediate composite. The curing agent masterbatch prepared by the curing agent intermediate composite of the invention can be dissolved and dispersed in the epoxy resin with more than 6 months of storage period and good storing stability. Besides, the curing agent requires lower curing temperature of 80 DEG C to the lowest extent, and has rapid curing speed, stable communication and resistance under the working environment of packaging of microelectronic products, simple preparation technique and is easy to be processed.

Description

technical field [0001] The invention relates to a latent curing agent capable of curing one-component epoxy resin, especially a curing agent intermediate composition for preparing the latent curing agent and a latent curing agent using the composition. Background technique [0002] The improvement of the transmission speed of large-scale integrated circuits (LSI) and the simplification of the electronic machine structure have promoted the development of electronic packaging technology in the direction of miniaturization, high performance, high reliability and low cost, and the form of microelectronic packaging has only played an external role in the past. The function has changed to the function of internal connection, and low-cost and high-performance packaging forms such as chip on board (COB), chip pole package (CSP) and multi-chip module (MCM) have appeared one after another. Most of these packaging forms use imidazole latent Permanent curing agent, this kind of curing a...

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned various latent curing agents in the prior art can be used as curing agents for one-component epoxy resins to a certain extent, but the curing temperature is relatively high, generally above 120°C; The ability to resist shear force damage is not strong, which makes the storage performance worse. The storage period is generally a few days to dozens of days, and the short one is even only a few hours; the temperature required for microelectronic packaging is 65°C and the relative humidity is 95%. Under the working environment, after 300hrs, the conduction resistance is greater than 20Ω, the peel strength drops sharply, and the adhesive strength is less than 0.5kg / cm

[0006] Treat the adduct with trimethyl borate, add InCl dropwise 2 The metal complex curing agent obtained by the reaction is the epoxy resin with poor flexibility and weak impact resistance