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Method for plating piezoelectric composite

A technology of composites and conductive polymers, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, using vibrating fluids, etc., can solve problems such as increased cracking of thin coatings, expansion of epoxy resin, and unknown manufacturing methods , to achieve the effect of improving the acoustic performance

Inactive Publication Date: 2008-01-30
GE INSPECTION TECH LP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] Another problem with this configuration is that the sinking ceramic is difficult to solder
As a result, the heat of the soldering during the soldering process is carried by the epoxy, causing the epoxy to expand and further increasing the likelihood of cracking the thin plating and thus a defective solder connection
[0010] A transducer having multiple elements formed from ceramic without the elements sinking below the polymer would overcome many of the difficulties associated with prior art transducers described above, but such transducers and methods of making them are within the art so far still unknown

Method used

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  • Method for plating piezoelectric composite
  • Method for plating piezoelectric composite
  • Method for plating piezoelectric composite

Examples

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Embodiment Construction

[0027] Figure 2 depicts a multi-array transducer 10 incorporating the piezoelectric composite of the present invention. The transducer comprises a plurality of piezoelectric composite ceramic pillars 12 . Each ceramic pillar 12 is separated from adjacent ceramic pillars 12 by a non-conductive material 14, such as a polymer. In a preferred embodiment, the polymer is epoxy. The piezoceramic composite column is characterized by being capable of vibrating when exposed to electrical excitation to thereby generate mechanical or sound waves, hereinafter referred to as ultrasound, and generating electrical pulses when excited by incident sound waves. The preferred metallic material is lead zirconate titanate (PZT), although polycrystalline relaxor materials (PZN-PT materials) and biased electrostrictive materials (PMN-PT ferroelastic relaxors) known in the art can also be used. ) of other equivalent materials. Each ceramic post 12 or element includes an electrical connector 16 to a...

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Abstract

A method of manufacturing a piezo-composite element comprising a ceramic element (12) embedded in a polymer (14) such as epoxy for use in an ultrasonic transducer (10) includes first grinding the face of the composite and removing damaged ceramic (12) by acid etching the ceramic (12). The epoxy is then removed by plasma etching so that the ceramic (12) is slightly elevated above the epoxy. The composite is sputter plated so that a maximum temperature that could damage the p1a ting is not exceeded. The ceramic (12) is then poled so that a maximum temperate re that could damage the plating is not exceeded. Contacts (16) are then attached to the plating adjacent the ceramic (12). In an array, the ceramic elements (1 2) may be in the form of posts. The plurality of ceramic elements (12) is in staggered arrangement with the polymer (14).

Description

technical field [0001] The present invention relates to piezoelectric composites coated with plating and methods of applying the plating to provide improved adhesion and reliability, and more particularly to ultrasonic transducers having ceramic piezoelectric composites with arrays of ceramic posts and A method of manufacturing the transducer. Background technique [0002] The ultrasonic transducer incorporates one or more piezoelectric vibrators electrically connected to a pulse receiving unit in the form of an ultrasonic test unit. The piezoelectric transducer converts the electrical pulse from the pulse unit and converts the electrical signal into mechanical vibration, which is transmitted through a material coupled thereto, such as metal. Piezoelectric materials have the ability to receive mechanical vibrations from the material to which they are coupled and convert the mechanical vibrations into electrical pulses that are sent to a receiving unit. By tracking the time...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/06H01L41/22H10N30/01H10N30/06H10N30/092H10N30/20H10N30/85H10N30/853
CPCH01L41/37B06B1/0622H01L41/29H10N30/06H10N30/092
Inventor 凯利·E·耶特莱斯利·B·奈
Owner GE INSPECTION TECH LP
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