Method for encapsulating LED with rotary glue and optical etching technology

Abstract

A packaging method of white LED by rotating glue and lithography process mainly comprises a monochromatic LED chip, a lead wire, a phosphor glue layer and a chip substrate. The invention is characterized in that the phosphor glue layer is fabricated by the rotating glue process for forming the phosphor glue layer on the surface of the chip substrate, then the packaging of white LED is completed by lithography, developing, solidification and cutting processes. The invention has the advantages that the packaging method of LED by the rotating glue and lithography process can accurately control the thickness of the phosphor glue layer on the chip surface, promote the light quality and uniformity of luminescence from white LED after packaging, and promote the production efficiency of packaging.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor device, in particular to a method for encapsulating a light-emitting diode by using spinning glue and photolithography technology. technical background [0002] The existing high-brightness white light-emitting diode LED is formed by mixing various colors of light. For example, red, green and blue chips are combined to form white light through optical lens, or purple or ultraviolet light is used to excite RGB (red, green and blue) phosphors to obtain white light, or blue light is used to excite yellow phosphors to obtain white light. Among them, the use of blue LED chips to excite YAG yellow phosphors to produce white light is the most widely used. YAG yellow phosphors are mixed into epoxy resin or silica gel, mixed evenly, and then coated on blue chips by coating or dispensing. The disadvantage of this method is that if the coating dose of the yellow phosphor is not accurately contro...

AI Technical Summary

Problems solved by technology

However, this method also cannot ensure that the side of the chip is evenly coated with phosphor; because it is difficult to ensure seamless bonding between the light-emitting chip and the film, the light is reflected and refracted multiple times on the interface that is not completely bonded, resulting in Decrease in light extraction efficiency; in addition, since each light-emitting chip has to be pasted with cured film, the production efficiency is very low, which is not conducive to large-scale production, and this packaging method is only suitable for flip chips, and its application is greatly restricted

As for LED chip array packaging that needs to increase luminous flux, the existing packaging methods have low production efficiency, are not conducive to large-scale production, and product performance is greatly affected by the process, and the reliability is poor.

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