Electrodepositable coating compositions and methods for their production
A composition and electrodeposition technology, used in electrophoretic coatings, coatings, thin material processing, etc., can solve the problems of large gelation danger, high molecular weight resin stickiness, manufacturing difficulties, etc.
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Embodiment A
Deionized water
4098.13
1 Light stabilizers available from Ciba Geigy Corporation.
2 2,2'-Azobis(2-methylbutyronitrile) available from Du Pont Specialty Chemicals.
3 N-butoxypropanol solvent available from Dow Chemical Co.
4 Propylene glycol monomethyl ether solvent available from Dow Chemical Co.
5 50% tert-butylperoxyacetate in pine spirit available from Arkema Inc.
6 Diketimine formed from diethylenetriamine and methylisobutylketone (72.69% solids content in methylisobutylketone).
7 Blocked isocyanate curing agent at 79.5% solids in methyl isobutyl ketone. By combining 10 equivalents of isophorone diisocyanate with 1 equivalent of trimethylolpropane, 3 equivalents of bisphenol A ethylene oxide polyol (prepared at a bisphenol A:ethylene oxide molar ratio of 1:6) and 6 equivalents Prepared by reaction of primary hydroxyl groups from 1,2-butanediol.
[0117] Component A was heated to reflux in a 3 liter flask equipped with stirrer, thermoc...
Embodiment B1-B3
[0119] The dispersion prepared in Example A was divided into three equal portions. For Example B1, the solvent was removed from part 1 by distillation under reduced pressure. For Example B2, Part 2 was stirred at room temperature while 1% TMXDI (on a solids basis) was added over 1 hour as a 50 wt% solution in methyl isobutyl ketone. The solvent was then removed by distillation under reduced pressure. For Example B3, Part 3 was stirred at room temperature while 2% TMXDI (on a solids basis) was added over 1 hour as a 50 wt% solution in methyl isobutyl ketone. The solvent was then removed by distillation under reduced pressure.
Embodiment B4
[0120] For Example B4, 700 grams of the dispersion prepared in Example A were mixed with 627 grams of the resin prepared in Example H of US Patent Application Publication 2003 / 0054193 Al. For Example B5, the mixture of Example B4 was stirred at room temperature while adding a mixture of 2.26 g TMXDI and 2.26 methyl isobutyl ketone within 1 hour. The solvent was then removed by distillation under reduced pressure.
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