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Epoxy resin and use thereof

A technology of epoxy resin and application, applied in the field of epoxy resin, can solve the problems of high viscosity and brittleness, reduction of mechanical strength and heat resistance of epoxy resin, reduction of mechanical strength and heat resistance, etc., to achieve low viscosity, Effect of good fiber impregnation and low exothermic peak temperature

Active Publication Date: 2008-05-28
SWANCOR ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical strength and heat resistance of the diluted epoxy resin are significantly reduced. How to solve the high viscosity and brittleness of the epoxy resin without reducing its mechanical strength and heat resistance to improve the epoxy resin Processing workability is a problem to be solved in the industry

Method used

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  • Epoxy resin and use thereof
  • Epoxy resin and use thereof
  • Epoxy resin and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Embodiment one: the proportioning ratio of epoxy resin of the present invention and two kinds of epoxy resin formulations commonly used in the industry is as shown in table one and table two, wherein I is the existing epoxy resin formulation without adding diluent in the industry , II and IV are the formula of epoxy resin of the present invention, and III is the epoxy resin formula that adds n-butyl glycidyl ether [butyl glycol ether (BGE)] that the industry adopts now as diluent.

[0059] Table 1: Agent A:

[0060] project

I

II

III

IV

(1) Bisphenol A

epoxy resin

100

90

90

83

(2) Tripropylene glycol diacrylate

(tripropylene glycol diacrylate

(TPGDA))

0

10

0

17

(3) n-butyl glycidyl methyl ether [butyl

glycol ether (BGE)]

0

0

10

0

[0061] Ta...

Embodiment 2

[0100] Embodiment two: epoxy resin of the present invention and the proportioning ratio of the weight and number of existing epoxy resin formulations in the industry are shown in table five and table six, wherein I is the existing epoxy resin formulations in the industry without adding diluent , V and VI add trimethylolpropane triacrylate (trimethylolpropane triacrylate (TMPTA)) or ethylene glycol dimethacrylate (ethylene glycol dimethacrylate) (EGDMA) as the prescription of the epoxy resin of diluent for the present invention.

[0101] Table 5: Agent A:

[0102] project

I

V

VI

(1) Bisphenol A (Bisphenol A) epoxy

resin

100

90

90

(2) Trimethylolpropane triacrylate

(trimethylolpropane triacrylate

(TMPTA)

0

10

0

(3) Ethylene glycol dimethacrylate

(ethylene glycol dimethacrylate)

(EGDMA)

0

0

10

...

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Abstract

The invention relates to an epoxide resin and the use. The epoxide resin comprises an epoxide, the reacting deflocculating agent and the curing agent, wherein the reacting deflocculating agent is a monomer or oligomer of acrylate and methacrylate with the low viscosity in the ambient temperature and a or a plurality of unsaturated double bond reactive function group, the reacting deflocculating agent is charged in the epoxide resin and is mixed uniformly in order to form the host crystal of the epoxide formulation, the host crystal comprises the reacting deflocculating agent 5-30 parts and agent B which forms epoxy resin formulation comprised by curing agent, the weight percentage of the agent B and the host crystal is 20-50 :100. The invention can improve the gel time, the temperature of exothermic peak and the processing operation characteristic of viscosity in the hardening process of the epoxide, which reduces the mechanical properties of the cured epoxide less, improves the tenacity of the epoxide, is suitable for manufacturing structural element of large scale composite material (air vane, craft, car and aerial craft and the like), and has good operation time, low exothermic peak temperature and fiber immersing property.

Description

technical field [0001] The present invention relates to an epoxy resin, in particular to an epoxy resin that can significantly prolong the gel time (Geltime) during the hardening reaction without greatly reducing the mechanical properties of the epoxy resin and its application. Background technique [0002] The invention of epoxy resin has gone through a long period of time, and its industrial production and application are only in recent years. Two major discoveries at the end of the nineteenth century and the beginning of the twentieth century opened the curtain of epoxy resin. In 1891, Lindmann in Germany reacted hydroquinone and epichlorohydrin to form a resinous product. In 1909, Russian chemist Prileschajew discovered the reaction of anisole peroxide and olefins. Epoxy compounds can be generated, and these two chemical reactions are still the main pathways in the synthesis of epoxy resins. [0003] In 1938, Pierre Castan of Switzerland filed a patent application for t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00B29C70/06
Inventor 蔡朝阳余仕文陈清源
Owner SWANCOR ADVANCED MATERIALS CO LTD
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