Epoxy resin and use thereof

A technology of epoxy resin and application, which is applied in the field of epoxy resin, can solve the problems of epoxy resin, such as the reduction of mechanical strength and heat resistance, high viscosity and brittleness, and the reduction of mechanical strength and heat resistance, so as to achieve good fiber impregnation Effects of properties, low viscosity, and low exothermic peak temperature

Active Publication Date: 2011-04-06
SWANCOR ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical strength and heat resistance of the diluted epoxy resin are significantly reduced. How to solve the high viscosity and brittleness of the epoxy resin without reducing its mechanical strength and heat resistance to improve the epoxy resin Processing workability is a problem to be solved in the industry

Method used

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  • Epoxy resin and use thereof
  • Epoxy resin and use thereof
  • Epoxy resin and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Embodiment one: the proportioning ratio of epoxy resin of the present invention and two kinds of epoxy resin formulations commonly used in the industry is as shown in table one and table two, wherein I is the existing epoxy resin formulation without adding diluent in the industry , II and IV are the formula of epoxy resin of the present invention, and III is the epoxy resin formula that adds n-butyl glycidyl ether [butyl glycol ether (BGE)] that the industry adopts now as diluent.

[0059] Table 1: Agent A:

[0060]

[0061] Table 2: Agent B:

[0062]

[0063] A / B agent weight ratio 100:28.85 100:29.08 100:29.08 100:30

[0064] The materials in Table 1 and Table 2 are explained below:

[0065] The epoxy equivalent of bisphenol A Type epoxy resin is 176-184g / eq, and its viscosity at 25°C is 8000-12000cps;

[0066] Tripropylene glycol diacrylate TPGDA (tripropylene glycol diacrylate), its viscosity at 25°C is 7-17cps;

[0067] n-butyl glycidyl methyl ether BGE (...

Embodiment 2

[0100]Embodiment two: the proportioning ratio of epoxy resin of the present invention and the existing epoxy resin formula of the industry in parts by weight is shown in table five and table six, wherein I is the existing epoxy resin formula of the industry without adding diluent , V and VI add trimethylolpropane triacrylate (trimethylolpropane triacrylate (TMPTA)) or ethylene glycol dimethacrylate (ethylene glycol dimethacrylate) (EGDMA) as the prescription of the epoxy resin of diluent for the present invention.

[0101] Table 5: Agent A:

[0102]

[0103] Table 6: Agent B:

[0104]

[0105] A / B agent weight ratio 100:28.85 100:29.0 100:29.1

[0106] The experimental results of this embodiment to viscosity, exothermic peak temperature and gel time (Gel time) are shown in Table 7:

[0107] Table seven:

[0108]

[0109] The present embodiment is shown in Table 8 to the test result of mechanical strength and heat distortion temperature:

[0110] Table Eight:

[0...

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Abstract

The invention relates to an epoxy resin and a relative application. The epoxide resin comprises epoxy resin, reaction dilutent and hardener, wherein the reaction dilutent is monomer or oligomer of acrylate and methacrylate with low viscosity in the ambient temperature and at least one unsaturated double-bond reactive function group, the reaction dilutent is added in the epoxy resin and is mixed uniformly to form the main agent of the epoxy resin formulation, the main agent comprises the reaction dilutent of 5-30 parts and agent B formed by the hardener, the weight percentage of the agent B and the main agent crystal is 20-50:100. The invention can improve the gelatinizing time, the exothermic peak temperature and the processing operation character of viscosity in the hardening process of the epoxy resin, which reduces the mechanical properties of the cured epoxide less, improves the tenacity of the epoxide, is suitable for manufacturing structural element of large scale composite material (air vane, craft, car and aerial craft and the like), and has good operation time, low exothermic peak temperature and fiber immersing property.

Description

technical field [0001] The present invention relates to an epoxy resin, in particular to an epoxy resin that can significantly prolong the gel time (Geltime) during the hardening reaction without greatly reducing the mechanical properties of the epoxy resin and its application. Background technique [0002] The invention of epoxy resin has gone through a long period of time, and its industrial production and application are only in recent years. Two major discoveries at the end of the nineteenth century and the beginning of the twentieth century opened the curtain of epoxy resin. In 1891, Lindmann in Germany reacted hydroquinone and epichlorohydrin to form a resinous product. In 1909, Russian chemist Prileschajew discovered the reaction of anisole peroxide and olefins. Epoxy compounds can be generated, and these two chemical reactions are still the main pathways in the synthesis of epoxy resins. [0003] In 1938, Pierre Castan of Switzerland filed a patent application for t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00B29C70/06
Inventor 蔡朝阳余仕文陈清源
Owner SWANCOR ADVANCED MATERIALS CO LTD
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