Copper alloy material for lead frame and preparation method thereof

Abstract

The invention relates to a copper alloy material used for lead frame and the preparation method, belonging to the copper alloy material field; wherein nickel accounts for 0.9 to 3.5% (weight percentage), silicon accounts for 0.18 to 0.8%, phosphorus accounts for 0.02 to 0.1% and the rest is copper. The preparation method is that all the components according to the weight ratio are mixed and melted, after casting, hot forging, solid solution, multiple cold rolling, deformation and aging, the product is got. The copper alloy material used for lead frame has the advantages of tensile strength of 600 to 850MPa, conductivity of 45 to 65%IACS, elongation of 5 to 8% and softening temperature of 500 to 550 centigrade; thereby the requirements on the copper alloy material performance of the lead frame in electronic industrial field is well achieved; the copper alloy material can also be used in the copper alloy material field needing high strength and high conductive, such as contact lines in trolleys and electric locomotives, rotor bars of the high-speed turbine generator and inner liners of the large thrust rocket engines.

Description

technical field

[0001] The invention relates to the field of copper alloy materials, in particular to a copper alloy material for a lead frame and a preparation method thereof. Background technique

[0002] Integrated circuits are the foundation and core of the electronic information industry, and lead frame materials are one of the main materials for integrated circuit packaging. With the rapid development of large-scale and ultra-large-scale integrated circuits, higher requirements are put forward for the comprehensive performance of lead frame materials, and various countries pay more and more attention to its research and development.

[0003] At present, the existing copper-based lead frame materials mainly include CuNiSi system, CuFe system, CuFeP system, CuCrZr system, CuAg system, etc., and the most used ones mainly include CuFeP, CuNiSi and CuCrZr series. Domestic enterprises producing copper alloy strips for lead frames are small in scale and have few varieties an...