Copper alloy material for lead frame and preparation method thereof

A lead frame and copper alloy technology, applied in metal rolling, metal processing equipment, etc., can solve the problem of low comprehensive performance and achieve the effect of low alloy price, both strength and conductivity, and high softening temperature

Inactive Publication Date: 2008-07-23
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are few documents related to CuNiSi series copper alloy materials. U.S. Patent US5846346 adds Sn on the basis of CuNiSi to improve its strength; Japanese patent application 200510065789.X in China involves CuNiSi series copper alloys, which are characterized by adding Zn and Mg More

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: Weigh 1.3% nickel, 0.23% silicon, 0.03% phosphorus according to the weight percentage, and the rest is copper, melt each component at 1200-1350°C after mixing, pour into the casting mold after melting, and form an ingot; for the ingot Hot forging, the temperature is 850-900°C, the forging deformation is 70%, and the hot forging material is obtained; the hot forging material is subjected to solution treatment, the temperature is 860°C, the holding time is 1h, and then quenched in water to obtain the cold material ; This cold material pre-cold-rolling process, deformation is 70%, obtains pre-cold-rolled material; To the pre-cold-rolled material graded aging treatment is twice, first graded aging treatment, aging temperature is 450 ℃, holding time is After 2 hours, cold rolling treatment with a deformation of 40% was carried out, and then the second step aging treatment was carried out. The aging temperature was 420° C., and the holding time was 3 hours to obt...

Embodiment 2

[0022] Embodiment 2: Weigh 2.1% nickel, 0.4% silicon, 0.06% phosphorus according to the weight percentage, and the rest is copper, after mixing the components, melt at 1200-1350°C, pour into the casting mold after melting, and form an ingot; for the ingot Hot forging, the temperature is 850-900°C, the forging deformation is 80%, and the hot forging material is obtained; the hot forging material is subjected to solid solution treatment, the temperature is 900°C, the holding time is 1h, and then quenched in water to obtain the cold material ; This cold material is pre-cold-rolled, and the amount of deformation is 45%, so that the pre-cold-rolled material is obtained; the graded aging treatment of the pre-cold-rolled material is twice, and the first graded aging treatment, the aging temperature is 450 ℃, and the holding time is 2h, carry out the cold-rolling treatment that deformation is 35% again, then carry out second graded aging treatment, aging temperature is 410 ℃, and holdi...

Embodiment 3

[0023] Embodiment 3: Weigh 1.3% nickel, 0.23% silicon, 0.03% phosphorus according to the weight percentage, and the rest is copper. After mixing the components, they are melted at 1200-1350° C., and poured into the mold after melting to form an ingot; for the ingot Hot forging, the temperature is 850-900°C, the forging deformation is 65%, and the hot forging material is obtained; the hot forging material is subjected to solid solution treatment, the temperature is 890°C, the holding time is 1h, and then quenched in water to obtain the cold material ; The pre-cold rolling treatment of this cold material, deformation is 60%, obtains the pre-cold-rolled material; The graded aging treatment to the pre-cold-rolled material is twice, the first graded aging treatment, the aging temperature is 450 ℃, and the holding time is 2h, carry out the cold-rolling treatment that deformation is 40% again, then carry out second graded aging treatment, aging temperature is 410 ℃, and holding time i...

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Abstract

The invention relates to a copper alloy material used for lead frame and the preparation method, belonging to the copper alloy material field; wherein nickel accounts for 0.9 to 3.5% (weight percentage), silicon accounts for 0.18 to 0.8%, phosphorus accounts for 0.02 to 0.1% and the rest is copper. The preparation method is that all the components according to the weight ratio are mixed and melted, after casting, hot forging, solid solution, multiple cold rolling, deformation and aging, the product is got. The copper alloy material used for lead frame has the advantages of tensile strength of 600 to 850MPa, conductivity of 45 to 65%IACS, elongation of 5 to 8% and softening temperature of 500 to 550 centigrade; thereby the requirements on the copper alloy material performance of the lead frame in electronic industrial field is well achieved; the copper alloy material can also be used in the copper alloy material field needing high strength and high conductive, such as contact lines in trolleys and electric locomotives, rotor bars of the high-speed turbine generator and inner liners of the large thrust rocket engines.

Description

technical field [0001] The invention relates to the field of copper alloy materials, in particular to a copper alloy material for a lead frame and a preparation method thereof. Background technique [0002] Integrated circuits are the foundation and core of the electronic information industry, and lead frame materials are one of the main materials for integrated circuit packaging. With the rapid development of large-scale and ultra-large-scale integrated circuits, higher requirements are put forward for the comprehensive performance of lead frame materials, and various countries pay more and more attention to its research and development. [0003] At present, the existing copper-based lead frame materials mainly include CuNiSi system, CuFe system, CuFeP system, CuCrZr system, CuAg system, etc., and the most used ones mainly include CuFeP, CuNiSi and CuCrZr series. Domestic enterprises producing copper alloy strips for lead frames are small in scale and have few varieties an...

Claims

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Application Information

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IPC IPC(8): C22C9/06C22C1/02B21J5/00C22F1/08B21B1/46
Inventor 刘平贾淑果张毅赵冬梅田保红李宏磊陈少华宋克兴任凤章娄华芬苏娟华
Owner UNIV OF SHANGHAI FOR SCI & TECH
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