Prepreg and laminate

A technology of prepreg and base material, applied in the field of prepreg and laminate, can solve the problem of low tolerance, and achieve the effect of high fire resistance, excellent chemical resistance, and excellent heat resistance after moisture absorption

Active Publication Date: 2008-08-13
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Resistance to chemicals such as bases or acids tends to be extremely low when gibbsite (which is the common structure of aluminum hydroxide) is added in large amounts

Method used

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Examples

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Embodiment

[0039] The present invention is explained in detail below with reference to synthesis examples, examples and comparative examples, but the present invention is not limited by these examples.

Synthetic example 1

[0040] (Synthesis example 1) Synthesis-1 of α-naphthol aralkyl type cyanate resin

[0041]

[0042] 103 g (0.47 moles of OH groups) of α-naphthol aralkyl resin (SN485, OH group equivalent: 219 g / eq., softening point: 86° C.) represented by the above general formula (4) were prepared by NipponSteel Chemical Co. ., Ltd.) was dissolved in 500 ml of chloroform, and 0.7 mol of triethylamine was mixed with the resulting solution. The resulting mixture was added dropwise to a solution of 0.93 molar cyanogen chloride in 300 g of chloroform at -10°C over 1.5 hours. The mixture was stirred for 30 minutes. To the mixture was further added dropwise a mixed solution of 0.1 mol of triethylamine and 30 g of chloroform, and the resulting mixture was stirred for 30 minutes to complete the reaction. The resulting triethylamine hydrochloride was isolated by filtration. The filtrate thus obtained was washed with 500 ml of 0.1N hydrochloric acid. The washing was then repeated 4 times with 5...

Synthetic example 2

[0044] (Synthesis example 2) Synthesis-2 of α-naphthol aralkyl type cyanate resin

[0045]An α-naphthol aralkyl type cyanate resin was synthesized in the same manner as in Synthesis Example 1, except that 103 g (0.47 moles of OH groups) of an α-naphthol aralkyl resin (SN485, OH group equivalent: 219 g / eq., softening point: 86°C, provided by Nippon Steel Chemical Co., Ltd.) replaced by 102 g (OH group 0.45 mole) α-naphthol aralkyl resin (SN4105, OH group equivalent: 226 g / eq., softening point: 105°C, provided by Nippon Steel Chemical Co., Ltd.), and the amount of cyanogen chloride was changed from 0.93 moles to 0.90 moles.

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Abstract

The present invention relates to prepregs and laminates, in particular to silicone powders containing specific cyanate resins, halogen-free epoxy resins, boehmite which is hardly soluble in acids or alkalis, and as flame retardant adjuvants Prepregs for printed wiring boards of fire-resistant resin compositions and base materials that remain highly fire-resistant without halogen compounds and have excellent chemical resistance, high glass transition temperature, excellent Solder heat resistance and excellent heat resistance after moisture absorption, and laminates or metal-foil-clad laminates obtained by curing the above prepregs.

Description

technical field [0001] The present invention relates to a prepreg for a printed wiring board comprising a resin composition having fire resistance, and a laminate and a metal-clad laminate each comprising the above prepreg. Background technique [0002] Semiconductors have been widely used in electronic equipment, communication devices and personal computers. High integration, high functionality, and high-density packaging of semiconductors are developing. Its development speed is getting faster and faster. In particular, the technology of mobile devices represented by mobile phones has rapidly advanced in recent years. Technological innovations aimed at realizing a ubiquitous computer society are remarkable. [0003] Semiconductor packaging has developed from QFP to area mounting type semiconductor packaging, such as BGA and CSP. In addition, high-function semiconductor packages such as MCP and SIP appear. Therefore, the forms of semiconductor packages are becoming div...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/00C08L63/00C08K3/00B32B27/04B32B15/08
CPCC08J5/24B32B15/08H05K1/0313C08J2367/00C08J2463/00C08K2003/2227C08J2483/04
Inventor 加藤祯启上野雅义信国豪志
Owner MITSUBISHI GAS CHEM CO INC
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