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Photosensitive resin composition and photosensitive element

一种感光性树脂、感光性组合物的技术,应用在感光性树脂组合物及感光性组件领域,能够解决正型光阻则不能具有充分分辨率、存在问题、剥离等问题,达到优良光感度的效果

Inactive Publication Date: 2008-08-27
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when a strong alkaline solution such as tetramethylammonium hydroxide is used for development, the unexposed part is often prone to peeling off.
Thus, the above-mentioned positive photoresist cannot have sufficient resolution
In addition, when a strong alkali aqueous solution is used, there are also environmental problems such as safety and waste liquid treatment.

Method used

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  • Photosensitive resin composition and photosensitive element
  • Photosensitive resin composition and photosensitive element
  • Photosensitive resin composition and photosensitive element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~3 and comparative example 1、2

[0131] The photosensitive resin compositions of Examples 1-3 and Comparative Examples 1 and 2 were prepared by mixing (a) component, (b) component, and other components according to the composition (unit: parts by mass) shown in Table 1. The details of the compounds in Table 1 are as follows. In addition, the mass in Table 1 is the mass of a non-volatile component.

[0132] PCR-1150: acid-modified phenol novolak type epoxy acrylate oligomer (manufactured by Nippon Kayaku Co., Ltd., trade name),

[0133] DNQ: 1,2-diazoquinone compound obtained by reacting 1 mole of the compound represented by the above chemical formula (5) with 3 moles of 1,2-naphthoquinone-2-diazide-5-chlorosulfonyl,

[0134] PGMEA: Propylene Glycol Monomethyl Ether Acetate,

[0135] MEK: methyl ethyl ketone.

[0136] [Table 1]

[0137] Example 1

Example 2

Example 3

Comparative example 1

Comparative example 2

(a)

Element

Novolac resin A11

80

...

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PUM

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Abstract

A photosensitive resin composition comprising compound (a) obtained by reacting a polybasic acid anhydride with phenolic hydroxyl of a novolac phenolic resin and 1,2-quinonediazide compound (b). A photosensitive resin composition satisfactorily excelling in photosensitivity, image contrast, resolution and adherence can be obtained by addition of the component of 1,2-quinonediazide compound (b) to the component (a) obtained by reacting a polybasic acid anhydride with phenolic hydroxyl of a novolac phenolic resin.

Description

technical field [0001] The present invention relates to a photosensitive resin composition and a photosensitive component Background technique [0002] Among the image forming methods used for patterning semiconductor integrated circuits, liquid crystal display elements, printed circuit boards, etc., methods using positive photoresists obtained by combining novolak-type phenolic resins and 1,2-diazoquinone compounds are known. [0003] The positive photoresist is that the unexposed part is alkali-insoluble, and the exposed part is alkali-soluble, and the photoresist at the exposed part is removed during alkali development. At this time, the 1,2-diazoquinone compound in the above-mentioned unexposed portion will cause interaction with the novolak type phenolic resin to act as a dissolution inhibitor, thereby forming alkali insolubility. [0004] In addition, in the exposed part, the 1,2-diazoquinone compound is decomposed by the irradiation of ultraviolet rays, which causes ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023G03F7/004G03F7/022H01L21/027
CPCG03F7/0007G03F7/0236G03F7/004G03F7/0045G03F7/008G03F7/022
Inventor 泽边贤野尻刚
Owner RESONAC CORP