Process and equipment for etching and drying silicon solar cell

Abstract

The invention provides a cleaning, etching, drying process and device of silicon solar energy cell. The process is: firstly cleaning with ultrasonic groove; generating O<3> in deionized water by ultrasonic and adding NaOH in the deionized water; then putting the silicon chip to the process ultrasonic cleaning in the deionized water; after the cleaning, drying when the silicon chip is lifted above the liquid level; a N<2> nozzle is mounted on an upper side of the drying groove. The silicon chip directly contacts the N<2> in high concentration after the silicon chip is lifted above the liquid level; drying with N<2> containing saturated IPA, then loading. A cleaning basket where the silicon chip is placed is transmitted by a delivery mechanism in sequence to the ultrasonic cleaning groove, the deionized water ultrasonic cleaning groove, then to a drying loading system under N<2>(IPA) atmosphere. The whole cleaning, drying process use extremely little chemical agents, which greatly reduces environment pollution, saves water resource with very simple process.

Description

technical field [0001] The invention relates to a method for cleaning, etching and drying silicon solar cells and an integrated processing machine. Background technique [0002] Solar photovoltaic cell is an important part of new technology and renewable environment-friendly energy, and it is the most promising energy technology in the world today. Silicon solar cells are the core part of photovoltaic cells. High-efficiency silicon solar cells require a series of technologies to complete the silicon surface treatment. At present, in the surface treatment of silicon solar cells, the traditional RCA method is mainly used to clean silicon wafers. This process needs to consume a lot of chemical reagents and water sources to complete the cleaning of silicon wafers. Most of the chemical reagents are harmful to the operator and the environment. Bring considerable pollution and danger. The current cleaning is a very complicated process. The cleaning process adopts stirring, N 2 T...

AI Technical Summary

Problems solved by technology

At present, in the surface treatment of silicon solar cells, the traditional RCA method is mainly used to clean silicon wafers. This process needs to consume a lot of chemical reagents and water sources to complete the cleaning of silicon wafers. Most of the chemical reagents are harmful to the operator and the environment. Bring considerable pollution and danger

The current cleaning is a very complicated process. The cleaning process adopts stirring, N 2 The method of bubbling, high energy consumption, high pollution, and the processing texture is prone to inconsistent roughness

Etching and cleaning need to consume a lot of strong acid and alkali, a large amount of water, complicated process and expensive equipment

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